| PART |
Description |
Maker |
| AM49DL640BG25IS AM49DL640BG25IT AM49DL640BG35IS |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 堆叠式多芯片封装（MCP）闪存和SRAM
|
Spansion, Inc.
Spansion Inc.
Advanced Micro Devices
|
| 2-1534127-1 |
AMP MCP 2.8 SOCKET HSG., 21POS., SEALED WITH SECONDARY LOCKING DEVICE
|
Tyco Electronics
|
| 3-1418883-1 4-1418883-1 1-1418883-1 2-1418883-1 |
AMP MCP 1.5K
AMP MCP 1.5K
|
Tyco Electronics
|
| DS42546 AM29DL163D |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
From old datasheet system
MCP Flash Memory and SRAM
|
AMD[Advanced Micro Devices]
|
| AM50DL128BH56I AM50DL128BH70I AM50DL128BH70IS |
Circular Connector; No. of Contacts:56; Series:MS27505; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:25; Circular Contact Gender:Socket; Circular Shell Style:Box Mount Receptacle RoHS Compliant: No
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 堆叠式多芯片封装（MCP）闪存和SRAM
|
Advanced Micro Devices, Inc.
|
| INTERSILCORP-X9241AWSZT2 X9241AWSZT1 |
Quad Digital Controlled Potentionmeters (XDCP™), Non-Volatile/Low Power/2-Wire/64 Taps; Temperature Range: 0°C to 70°C; Package: 20-SOIC T&R
|
INTERSIL CORP
|
| KBY00U00VA-B450 |
MCP Specification
|
Samsung semiconductor
|
| 1851342 |
FK-MCP 1,5/13-STF-3,81
|
Phoenix Contact
|
| K522H1HACF-B050 |
MCP Specification
|
Samsung semiconductor
|
