| PART |
Description |
Maker |
| SF400L4B1 |
(SF400Lxx1) Flat Package Thyristor Stack
|
Toshiba
|
| PM15CNJ060 E80271 E80276 |
MITSUBISHI <INTELLIGENT POWER MODULES> FLAT-BASE TYPE INSULATED PACKAGE 三菱\u003cINTELLIGENT POWER MODULES\u003e平性基地型绝缘包装
INTELLIGENT POWER MODULES FLAT-BASE TYPE INSULATED PACKAGE
MITSUBISHI FLAT-BASE TYPE INSULATED PACKAGE
IPMS Modules: 600V
|
Mitsubishi Electric, Corp.
MITSUBISHI[Mitsubishi Electric Semiconductor]
Mitsubishi Electric Corporation
|
| PM300CVA06005 PM300CVA060 PM300CVA06009 |
FLAT-BASE TYPE INSULATED PACKAGE
INTELLIGENT POWER MODULES FLAT-BASE TYPE INSULATED PACKAGE
|
Mitsubishi Electric Sem...
Mitsubishi Electric Semiconductor
|
| MAX6410 MAX6407 MAX6406 MAX6408 MAX6409BS45-T MAX6 |
Voltage Detectors in 4-Bump (2 x 2) Chip-Scale Package
VoIP Ringing SLIC; Temperature Range: 0°C to 70°C; Package: 28-PLCC
VoIP Ringing SLIC; Temperature Range: 0°C to 70°C; Package: 28-PLCC 1-CHANNEL POWER SUPPLY SUPPORT CKT, PBGA4
ITU CO/PABX SLIC with Low Power Standby; Temperature Range: 0°C to 70°C; Package: 28-PLCC
Round Conductor Flat Cable, 3754/50 30 AWG, .025 (0.64)
Round Conductor Flat Cable, 3754/34 30 AWG, .025 (0.64)
Round Conductor Flat Cable, 3754/20 30 AWG, .025 (0.64)
Low-Capacitance 3-Channel /-15KV ESD-Protection Array for High-Speed Data Interfaces 5-SOT -40 to 85
Round Conductor Flat Cable, 3754/68 30 AWG, .025 (0.64)
700-mW Mono, Differential Input, Class-AB Audio Amplifier with Active Low Shutdown 24-BGA MICROSTAR JUNIOR -40 to 85 1-CHANNEL POWER SUPPLY SUPPORT CKT, PBGA4
|
MAXIM INTEGRATED PRODUCTS INC
MAXIM - Dallas Semiconductor
MAXIM[Maxim Integrated Products]
Maxim Integrated Products, Inc.
|
| PS11011 |
Application Specific Intelligent Power Module FLAT-BASE TYPE INSULATED PACKAGE
FLAT-BASE TYPE INSULATED TYPE
|
Mitsubishi Electric Semiconductor
POWEREX[Powerex Power Semiconductors]
|
| MSCD022SH MSCD024SH |
Thin flat package
|
Zowie Technology Corporation
|
| MSCD102SH MSCD104SH MSCD106SH |
Thin flat package
|
Zowie Technology Corporation
|
| PM200CSE060 |
FLAT-BASE TYPE INSULATED INSULATED PACKAGE 平性基地型绝缘绝缘包装
FLAT-BASE TYPE INSULATED PACKAGE
|
Mitsubishi Electric, Corp.
MITSUBISHI[Mitsubishi Electric Semiconductor]
|
| PL00101-WCY06 |
Flat lens package 3.2 x 1.6 x 1.4mm
|
P-tec Corporation
|
| PM50B6LA060 |
FLAT-BASE TYPE INSULATED PACKAGE
|
Mitsubishi Electric Semiconductor
|
| PM25RSB120 |
FLAT-BASE TYPE INSULATED PACKAGE
|
MITSUBISHI[Mitsubishi Electric Semiconductor]
|
