| PART |
Description |
Maker |
| 0479890312 47989-0312 |
1.00mm (.039") by 1.00mm (.039") Pitch rPGA 988B Notebook PC CPU Socket,with Mylar, Hard Tray Packaging
1.00mm (.039) by 1.00mm (.039) Pitch rPGA 988B Notebook PC CPU Socket,with Mylar, Hard Tray Packaging
|
Molex Electronics Ltd.
|
| 0479890132 47989-0132 |
1.00mm (.039") by 1.00mm (.039") Pitch rPGA 989 Notebook PC CPU Socket, with Pick-and-Place Cover, Hard Tray Packaging, 989 Circuits, Lead free
1.00mm (.039) by 1.00mm (.039) Pitch rPGA 989 Notebook PC CPU Socket, with Pick-and-Place Cover, Hard Tray Packaging, 989 Circuits, Lead free
|
Molex Electronics Ltd.
|
| 54698-7007 |
0.80mm (.031) Pitch S.O. DIMM Socket, Right Angle, Surface Mount, 5.20mm (.205) Mounted Height, 144 Circuits, 5.0V Power Supply, Hard Tray Packaging, Height9.00mm (.354) Type, Lead-free
|
Molex Electronics Ltd.
|
| 87914-2815 0879142815 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75μm (30μ) Gold (Au) Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75渭m (30渭) Gold (Au) Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75楼矛m (30楼矛) Gold (Au) Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 0528304432 52830-4432 |
Modular Jack, Right Angle, 4/4, 0.76μm (30μ) Gold (Au) Plating, with Beveled MetalPins, Tray Packaging, Lead-free
Modular Jack, Right Angle, 4/4, 0.76楼矛m (30楼矛") Gold (Au) Plating, with Beveled MetalPins, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 87891-4006 |
2.54mm (.100) Pitch KK庐 Header, Through Hole, Breakaway, Vertical, 40 Circuits, 2.50渭m (100渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch KK? Header, Through Hole, Breakaway, Vertical, 40 Circuits, 2.50μm (100μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 87891-0206 0878910206 |
2.54mm (.100) Pitch KK庐 Header, Through Hole, Breakaway, Vertical, 2 Circuits, 2.54渭m (100渭) Tin (Sn) Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch KK? Header, Through Hole, Breakaway, Vertical, 2 Circuits, 2.54μm (100μ) Tin (Sn) Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 87891-0204 0878910204 |
2.54mm (.100) Pitch KK庐 Header, Through Hole, Breakaway, Vertical, 2 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch KK? Header, Through Hole, Breakaway, Vertical, 2 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 0879143435 87914-3435 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 34 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 34 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 0879143016 87914-3016 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 30 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 30 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 0674921121 67492-1121 |
1.27mm (.050") Pitch Serial ATA Host Receptacle, Right Angle, SMT, Mating Height 3.55mm (.140"), 0.76渭m (30渭") Gold (Au) Plating, Tray Packaging, 22 Circuits, L
1.27mm (.050) Pitch Serial ATA Host Receptacle, Right Angle, SMT, Mating Height 3.55mm (.140), 0.76μm (30μ) Gold (Au) Plating, Tray Packaging, 22 Circuits, LeadFree
|
Molex Electronics Ltd.
|
| 0528304442 52830-4442 |
Modular Jack, Right Angle, 4/4 Circuits, 1.3μm (50μ) Gold (Au) Selective Plating, withBeveled Metal Pins, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
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