PART |
Description |
Maker |
DB2141200L |
Embossed type (Thermo-compression sealing) : 3 000 pcs / reel (standard)
|
Panasonic Battery Group
|
DB2430100L |
Embossed type (Thermo-compression sealing) : 3 000 pcs / reel (standard)
|
Panasonic Battery Group
|
DB2230400L |
Embossed type (Thermo-compression sealing) : 3 000 pcs / reel (standard)
|
Panasonic Battery Group
|
DB3X207K |
DB3X207K0L Embossed type (Thermo-compression sealing): 3000 pcs / reel (standard)
|
Panasonic Battery Group
|
CMR200T CMR200T1 CMR250T |
LEAD FORMED SMD TYPE WITH EMBOSSED TAPE
|
List of Unclassifed Manufacturers ETC
|
GRM21BR71H224KA01L GRM21BR71H224KA01K |
φ180, 330mm Embossed taping
|
Murata Manufacturing Co., Ltd.
|
HMK316AC7225ML-TE |
Standard packaging quantity (minimum) Taping Embossed 2000pcs
|
Taiyo Yuden (U.S.A.), I...
|
67492-1631 0674921631 |
1.27mm (.050") Pitch Serial ATA Host Receptacle, Right Angle, SMT, Mating Height 4.45mm (.175"), 0.76渭m (30渭") Gold (Au) Plating, with Cap,Embossed Tape on Reel 1.27mm (.050) Pitch Serial ATA Host Receptacle, Right Angle, SMT, Mating Height 4.45mm (.175), 0.76μm (30μ) Gold (Au) Plating, with Cap,Embossed Tape on ReelPackaging,22 Circuits, Lead Free
|
Molex Electronics Ltd.
|
0714392464 71439-2464 |
1.00mm (.039") Pitch Mezzanine IEEE 1386 Receptacle, Surface Mount, Dual Row,Vertical Stacking, Embossed Tape on Reel, 0.76渭m (30渭") Gold (Au), 64 Circuits Pick 1.00mm (.039) Pitch Mezzanine IEEE 1386 Receptacle, Surface Mount, Dual Row,Vertical Stacking, Embossed Tape on Reel, 0.76μm (30μ) Gold (Au), 64 Circuits Pick
|
Molex Electronics Ltd.
|
0714390864 71439-0864 |
1.00mm (.039) Pitch Mezzanine IEEE 1386 Receptacle, Surface Mount, Dual Row, Vertical Stacking, Embossed MOLEX Connector
|
Molex Electronics Ltd.
|
0791098406 |
2.00mm (.079) Pitch Milli-Grid Receptacle, Surface Mount, Vertical, Top/Bottom Entry, without Press-fit Plastic Pegs, with Cap, Embossed Tape on Reel
|
Molex Electronics Ltd.
|
|