| PART |
Description |
Maker |
| 21-0041 |
PACKAGE OUTLINE, 8L, 14L, 16L SOIC, 150INCH
|
Maxim Integrated Products
|
| MDP0040 |
PACKAGE OUTLINE DRAWING QSOP - 0.150 NARROW BODY PACKAGE
|
Elantec Semiconductor
|
| AP2301BGN-HF AP2301BGN-HF-14 |
2.8 A, 20 V, 0.13 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
Advanced Power Electron...
|
| AP2309AGN-HF |
3.4 A, 30 V, 0.075 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
|
| TO92 |
Through hole, 3 pin package Package outline
|
Zetex Semiconductors
|
| MSA20 |
20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide Package Number MSA20 20 -铅收缩小型封装（SSOP封装），EIAJ型二.3mm宽包MSA20
|
Fairchild Semiconductor, Corp.
Fairchild Semiconductor Corporation
|
| SOP-20 |
Package Outline
|
Global Mixed-mode Techn...
|
| TDFN3X3-10 |
Package Outline
|
Global Mixed-mode Techn...
|
| HTSSOP-14 |
Package Outline
|
Global Mixed-mode Techn...
|
| TO252-5 |
Package Outline
|
Global Mixed-mode Techn...
|
| SOT143 |
Package Outline
|
Global Mixed-mode Techn...
|
