| PART |
Description |
Maker |
| HSM107S |
MPAK package is suitable for high density surface mounting and high speed assembly.
|
TY Semiconductor Co., Ltd
|
| HSM88ASR |
MPAK package is suitable for high density surface mounting and high speed assembly
|
TY Semiconductor Co., Ltd
|
| HSB88WA |
CMPAK package is suitable for high density surface mounting and high speed assembly
|
TY Semiconductor Co., Ltd
|
| BAS516 |
Small Surface Mounting Type, High Speed
|
TY Semiconductor Co., Ltd
|
| KD2003-DG10A |
Compact high speed thick film thermal printhead (8dots / mm)
|
Rohm
|
| KF2003-GF41A |
Compact high speed thick film thermal printhead (8dots / mm)
|
Rohm
|
| PC417 |
Compact/ Surface Mount Ultra-high Speed Response OPIC Photocoupler
Compact, Surface Mount Ultra-high Speed Response OPIC Photocoupler
|
Sharp Electrionic Components
|
| EB2 |
COMPACT AND LIGHT WEIGHT SURFACE MOUNTING TYPE
|
NEC Corp.
|
| SSH66XU12N100 |
Compact Switch for internal or external mounting via 1/2NPT thread
|
Cynergy3 Co
|
| SIM765170 |
AC Semiconductor Contactor pitch 45mm compact size and DIN rail mounting.
|
celduc-relais
|
| SIL855160 |
AC Semiconductor Contactor pitch 22,5mm compact size and DIN rail mounting.
|
celduc-relais
|
| SIL842970 |
AC Semiconductor Contactor pitch 22,5mm compact size and DIN rail mounting.
|
http://
celduc-relais
|
