PART |
Description |
Maker |
FCSP230LTR FCSP230LTR11 |
FlipKY, 1.5 A Chip Scale Package Schottky Barrier Rectifier
|
Vishay Siliconix
|
IR1H40CSP |
Flipky - 1 Amp From old datasheet system 40V 1A Schottky Diode in a Flipky package. Flipky is 1/5 the footprint of a SMA package
|
IRF[International Rectifier] International Rectifier Corp.
|
IR140CSP IR140CSPTR |
40V 1A Schottky Diode in a Flipky package. Flipky is 1/5 the footprint of a SMA package.
|
International Rectifier
|
ADG758 ADG759 ADG759BCP ADG758BCP |
3 OHM, 4-/8-CHANNEL MULTIPLEXERS IN CHIP SCALE PACKAGE
|
AD[Analog Devices]
|
CSPESD303 CSPESD302 CSPESD301 |
"1, 2 and 3-channel ESD Arrays in Chip Scale Package "
|
California Micro Devices
|
SDM0230CSP |
0.2A SCHOTTKY BARRIER DIODE CHIP SCALE PACKAGE
|
Diodes Incorporated
|
SDM02U30CSP SDM02U30CSP-7 |
0.2A SCHOTTKY BARRIER DIODE CHIP SCALE PACKAGE
|
Diodes Incorporated
|
CSPRC032A |
EMI/RFI Filter Network, Chip Scale Package
|
California Micro Devices Corp
|
ADG781 ADG781BCP ADG782 ADG782BCP |
2.5 ohm Quad SPST Switches in Chip Scale Package
|
Analog Devices
|
MAX16072RSD MAX16073RSD MAX16074RSD MAX16072 MAX16 |
楼矛P Supervisory Circuits in 4-Bump (1mm x 1mm) Chip-Scale Package μP Supervisory Circuits in 4-Bump (1mm x 1mm) Chip-Scale Package
|
Maxim Integrated Products
|
28F3204C3 |
3 V Advanced Stacked Chip Scale Package Memory(3V高级堆芯片封装存储器) 3伏高级堆叠芯片级封装存储器(3V的高级堆芯片封装存储器)
|
Intel, Corp.
|