PART |
Description |
Maker |
A82DL16X4TU |
Stacked Multi-Chip Package
|
AMIC Technology
|
AM42DL6404G |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
Advanced Micro Devices
|
AM42BDS6408G |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
Advanced Micro Devices
|
A82DL1624T |
(A82DL16x4T) Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
AMIC Technology
|
S73WS-P S75WS256NDGBFWLH2 S75WS256NDGBFWLH0 S75WS2 |
Stacked Multi-Chip Product (MCP) SPECIALTY MEMORY CIRCUIT, PBGA84 Stacked Multi-Chip Product (MCP) 堆叠式多芯片产品(MCP
|
Spansion Inc. Spansion, Inc.
|
M6MGD13VW66CWG-P |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
|
Renesas
|
M6MGE13VW34DWG |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
|
Renesas
|
M6MGB64BM34CWG-P M6MGT64BM34CWG-P |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
|
Renesas
|
M6MGD13TW66CWG |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
|
Renesas
|
AM45DL32X8G AM45DL3238GB85IT |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM SPECIALTY MEMORY CIRCUIT, PBGA73
|
ADVANCED MICRO DEVICES INC
|
AM50DL128CG85IS |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM SPECIALTY MEMORY CIRCUIT, PBGA88
|
Spansion, Inc.
|
DS42516 |
SPECIALTY MEMORY CIRCUIT, PBGA73 Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
SPANSION LLC ADVANCED MICRO DEVICES INC
|