| PART |
Description |
Maker |
| 90-0174 |
PACKAGE LAND PATTERN, (U5) 5L SOT23
|
Maxim Integrated Products
|
| 90-0092 |
PACKAGE LAND PATTERN, (U8) UMAX 8 LEAD
|
Maxim Integrated Products
|
| 90-0179 |
PACKAGE LAND PATTERN, (U3) SOT23, 3 LEADS
|
Maxim Integrated Products
|
| 90-0167 |
PACKAGE LAND PATTERN, (E16) 0.150 QSOP, 16 LEADS
|
Maxim Integrated Products
|
| 90-0107 |
PACKAGE LAND PATTERN, (216) 0.300 SOIC, 16 LEADS
|
Maxim Integrated Products
|
| 90-0117 |
PACKAGE LAND PATTERN, (U16) 4.4MM TSSOP, 16 LEADS
|
Maxim Integrated Products
|
| C1206C104C2RAC C0603C103Z5VAC C1206C103Z3VAC C1206 |
Fast Sample-and-Hold Circuit; Package: Land Pattern: Not Available; Temperature: 0°C to 70°C
CERAMIC CHIP/STANDARD 陶瓷芯片/标准
|
KEMET Corporation
|
| 90-0022 |
PACKAGE LAND PATTERN, (T2444-4 / T2444 4)
|
Maxim Integrated Products
|
| LPF7030T-220M LPF7030T-3R3M LPF7030T-4R7M LPF7030T |
Shape & Dimensions / Recommended Solder Land Pattern
|
ABCO ELECTRONICS CO.LTD
|
| LPF3010 LPF3010T-3R3M LPF3010T-6R8M LPF3010T-470M |
Shape & Dimensions / Recommended Solder Land Pattern
|
ABCO ELECTRONICS CO.LTD
|
| LPF1280T-5R8M LPF1280T-530M LPF1280T-3R5M LPF1280T |
Shape & Dimensions / Recommended Solder Land Pattern
|
ABCO ELECTRONICS CO.LTD
|
