PART |
Description |
Maker |
21-0057 |
PACKAGE OUTLINE, 5L SOT23
|
Maxim Integrated Products
|
21-0114B 21-0114 |
PACKAGE OUTLINE, 6 LEAD THIN SOT23, (LOW PROFILE) 封装外形引脚薄型SOT23封装,(小资料)
|
MAXIM - Dallas Semiconductor MAXIM[Maxim Integrated Products] Maxim Integrated Products, Inc.
|
SOD523 |
Surface mounted, 2 pin package Package outline
|
Zetex Semiconductors
|
AP2305AGN-HF |
3.2 A, 30 V, 0.06 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3 Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp. Advanced Power Electronics Corp.
|
AP2309AGN-HF |
3.4 A, 30 V, 0.075 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3 Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp. Advanced Power Electronics Corp.
|
TO92 |
Through hole, 3 pin package Package outline
|
Zetex Semiconductors
|
MSA20 |
20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide Package Number MSA20 20 -铅收缩小型封装(SSOP封装),EIAJ型二.3mm宽包MSA20
|
Fairchild Semiconductor, Corp. Fairchild Semiconductor Corporation
|
WLCSP6X6-36 |
Package Outline
|
Global Mixed-mode Techn...
|
SOT23-3 |
Package Outline
|
Global Mixed-mode Techn...
|
TSSOP-16-EP |
Package Outline
|
Global Mixed-mode Techn...
|
SSOP-28 |
Package Outline
|
Global Mixed-mode Techn...
|
MSOP-10-EP |
Package Outline
|
Global Mixed-mode Techn...
|