| PART |
Description |
Maker |
| 56-G6005-001 |
From old datasheet system
MARKETING OUTLINE - 16L CHIP SCALE BGA
|
DALLAS[Dallas Semiconductor]
Dallas Semiconducotr
|
| TO263 |
Package Outline Drawing Transistor Outline 封装外形图晶体管外形
|
Electronic Theatre Controls, Inc.
ETC
List of Unclassifed Manufacturers
|
| ICS280PGLF ICS280 ICS280PG ICS280PGILF ICS280PGI |
From old datasheet system
Package Outline and Package Dimensions (16-pin TSSOP,173 Mil. Body) 封装和封装尺寸（16引脚TSSOP封装173军医。体
|
Integrated Circuit Solu...
ICSI[Integrated Circuit Solution Inc]
Intersil, Corp.
|
| SOD523 |
Surface mounted, 2 pin package Package outline
|
Zetex Semiconductors
|
| SOT527-1 |
Package outline
|
NXP Semiconductors
PHILIPS[Philips Semiconductors]
|
| SOT23-3 |
Package Outline
|
Global Mixed-mode Techn...
|
| SOT23-5 |
Package Outline
|
Global Mixed-mode Techn...
|
| SOT23-6 |
Package Outline
|
Global Mixed-mode Techn...
|
| TSOT23-5 |
Package Outline
|
Global Mixed-mode Techn...
|
| TO220 |
Package Outline
|
Global Mixed-mode Techn...
|
| TQFN3.8X6.2-44 |
Package Outline
|
Global Mixed-mode Techn...
|
