| PART |
Description |
Maker |
| QSOP |
Shrink Small Outline, Quarter-Size Small-Outline Packages
|
Amkor Technology
|
| PG12232-E- PG12232-E-33 |
OUTLINE DIMENSION & BLOCK DIAGRAM 外形尺寸
OUTLINE DIMENSION & BLOCK DIAGRAM
|
Powertip Technology, Corp.
Powertip Technology Corp.
POWERTIP[Powertip Technology]
|
| 8SOIC |
8 PIN SOIC PACKAGE OUTLINE
8 PIN SOIC PACKAGE OUTLINE
|
SMSC[SMSC Corporation]
|
| PC1602-J |
OUTLINE DIMENSION & BLOCK DIAGRAM
OUTLINE DIMENSION & BLOCK DIAGRAM
|
Powertip Technology Corp.
POWERTIP[Powertip Technology]
http://
|
| 16769 16769-04 |
BOX 3.4X2.56X1.02 W/0 BTNS ALMOND
BOX 3.4X2.56X1.02 W/0 BTNS BLK2
OUTLINE DRAWING, HUB470-P
OUTLINE DRAWING HUB470-P
|
VICOR[Vicor Corporation]
|
| 080-25126-0001 |
OUTLINE L1
|
API Technologies Corp
|
| SOT416 |
Package outline
|
NXP Semiconductors
Philips Semiconductors
|
| DFN1.6X1.6-6 |
Package Outline
|
Global Mixed-mode Techn...
|
| MSOP-10 |
Package Outline
|
Global Mixed-mode Techn...
|
| TQFN3X6-32 |
Package Outline
|
Global Mixed-mode Techn...
|
| TQFN3X3-12 |
Package Outline
|
Global Mixed-mode Techn...
|
