| PART |
Description |
Maker |
| UPD23C32040LGX-XXX UPD23C32040LG5-XXX-7JF UPD23C32 |
x8 or x16 ROM (Mask Programmable) x8或x16光盘（掩模可编程
x8 or x16 ROM (Mask Programmable) x8x16光盘（掩模可编程
|
NEC, Corp.
飞思卡尔半导体(中国)有限公司
|
| GM23V16000A-30 GM23V16000A-25 GM23V16000A-15 |
x8 or x16 ROM (Mask Programmable) x8或x16光盘（掩模可编程
|
3M Company
|
| LH532000BN-15 LH532000BTR-15 LH532000BT-12 |
x8 or x16 ROM (Mask Programmable) x8或x16光盘（掩模可编程
|
Samsung Semiconductor Co., Ltd.
|
| GM23C4100A-15 |
x8 or x16 ROM (Mask Programmable) x8或x16光盘（掩模可编程
|
Macronix International Co., Ltd.
|
| UPD23C32000AGY-XXX-MJH UPD23C32000AGY-XXX-MKH UPD2 |
x8 or x16 ROM (Mask Programmable)
HITFET, TEMPFET - Smart Low-Side Switches x8或x16光盘（掩模可编程
|
NEC, Corp.
|
| UPD703100AGJ-33-UEN UPD703100GJ-33-UEN UPD703101AG |
ROM-less version; Internal RAM: 4K bytes
Mask ROM version; Mask ROM: 96K bytes; Internal RAM: 4K bytes
Mask ROM version; Mask ROM: 128K bytes; Internal RAM: 4K bytes
Flash version; Internal flash: 128K bytes; Internal RAM: 4K bytes
32-bit RISC microcontroller (V850E/MS2:ROMless,Internal RAM: 4 KB)
|
NEC
|
| MX23L1610PC-12G MX23L1610TC-12G |
3.3 Volt 16-Mbit (2M x 8 / 1M x 16) Mask ROM 1M X 16 MASK PROM, 120 ns, PDIP42
Resistor Wirewound 25.5 OHM 1% 0.75W 20PPM AXIAL Thru-Hole Bulk 1M X 16 MASK PROM, 120 ns, PDSO48
|
Macronix International Co., Ltd.
|
| MX23L1610 MX23L1610MC-10 MX23L1610MC-12 MX23L1610M |
3.3 Volt 16-Mbit (2M x 8 / 1M x 16) Mask ROM 1M X 16 MASK PROM, 150 ns, PDSO44
|
PROM
Macronix International Co., Ltd.
|
| MX23L4100 MX23L4100MC-10 MX23L4100MC-12 MX23L4100M |
4M-BIT MASK ROM (8/16 BIT OUTPUT) 256K X 16 MASK PROM, 100 ns, PDSO40
4M-BIT MASK ROM (8/16 BIT OUTPUT) 256K X 16 MASK PROM, 120 ns, PDIP40
4M-BIT MASK ROM (8/16 BIT OUTPUT) 256K X 16 MASK PROM, 100 ns, PDIP40
|
Macronix International Co., Ltd.
MCNIX[Macronix International]
|
| LC371000SM |
1M Mask Rom Internal Clocked Silicon Gate(1M带内部定时硅门的掩膜 ROM) 100万掩模ROM内部时钟硅门100万带内部定时硅门的掩膜光盘）
|
Sanyo Electric Co., Ltd.
|
