| PART |
Description |
Maker |
| IRG4CC50WB |
IGBT Die in Wafer Form 600 V Size 5 WARP Speed
IRG4CC50WB IGBT Die in Wafer Form
|
Hittite Microwave Corporation
International Rectifier
|
| MF1ICS2005W7D MF1ICS2005 MF1ICS2005U7D |
Sawn bumped 120レm wafer addendum
Sawn bumped 120μm wafer addendum
|
NXP Semiconductors N.V.
NXP[NXP Semiconductors]
|
| 5-211111-4 |
Subminiature D Pin/Socket Connectors for MIL-C-24308 and MIL-C-39029; AMPLI,SHELL,PLUG 11C1 ( AMP )
|
Tyco Electronics
|
| 1-1218437-0 |
Subminiature D Pin/Socket Connectors for MIL-C-24308 and MIL-C-39029; R/A RCP ASSY 50 POS SER 109 ( AMP )
|
Tyco Electronics
|
| 1-1218291-0 |
Subminiature D Pin/Socket Connectors for MIL-C-24308 and MIL-C-39029; AMPLI,ASSY,RCPT,POSTED,109,5 ( AMP )
|
Tyco Electronics
|
| 1-1218379-0 |
Subminiature D Pin/Socket Connectors for MIL-C-24308 and MIL-C-39029; 50 POS,ASSY,PLUG,LOW PROF,109 ( AMP )
|
Tyco Electronics
|
| 1-1218381-0 |
Subminiature D Pin/Socket Connectors for MIL-C-24308 and MIL-C-39029; 50 POS,ASSY,PLUG,LOW PROF,109 ( AMP )
|
Tyco Electronics
|
| 5962H9211802VYA 5962H9211802VYC 5962-9211803QZA 59 |
Octal, 13-Bit Voltage-Output DAC with Parallel Interface
MIL-STD-1553/ARINC Bus Controller/RTU MIL-STD-1553/ARINC总线控制 RTU通讯
±15kV ESD-Protected, Down to 10nA, 3.0V to 5.5V, Up to 1Mbps, True RS-232 Transceivers MIL-STD-1553/ARINC总线控制 RTU通讯
|
Intersil, Corp.
Maxwell Technologies, Inc
|
| MN31121SA |
WAFER
|
panasonic
|
| 125SH-G-XX-TR-SMT-TR |
WAFER RIGHT ANGLE
|
Adam Technologies, Inc.
|
| 5289-5A 10311028 0010311028 0010311048 0010311068 |
KK 5/7.5 WAFER ASSY WITH LOCK
|
Molex Electronics Ltd.
|
| CSPNL |
Wafer Level Packaging
|
Amkor Technology
|
