PART |
Description |
Maker |
HY62256A HY62256AJ HY62256AJ-I HY62256ALJ HY62256A |
32Kx8bit CMOS SRAM, standby current=25uA, 70ns 32Kx8bit CMOS SRAM, standby current=25uA, 55ns 32Kx8bit CMOS SRAM, standby current=25uA, 85ns 32Kx8bit CMOS SRAM, standby current=100uA, 70ns 32Kx8bit CMOS SRAM, standby current=100uA, 85ns 32Kx8bit CMOS SRAM, standby current=1mA, 70ns 32Kx8bit CMOS SRAM, standby current=1mA, 85ns 32Kx8bit CMOS SRAM, standby current=1mA, 55ns 32Kx8bit CMOS SRAM 32Kx8bit CMOS SRAM Circular Connector; No. of Contacts:22; Series:MS27497; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:12; Circular Contact Gender:Socket; Circular Shell Style:Wall Mount Receptacle RoHS Compliant: No 32Kx8bit CMOS SRAM JT 22C 22#22D SKT RECP 32Kx8bit CMOS SRAM
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Hynix Semiconductor, Inc. Hynix Semiconductor Inc. ETC HYNIX[Hynix Semiconductor] http://
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GLT6200L16LI-70FG GLT6200L16LI-85TC GLT6200L16LI-5 |
70ns; Ultra low power 128K x 16 CMOS SRAM 85ns; Ultra low power 128K x 16 CMOS SRAM 55ns; Ultra low power 128K x 16 CMOS SRAM
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G-LINK Technology
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UT6264 UT6264CE |
4 Mb (512K x 8, 256K x 16) Boot Sector, Flash Memory IC,SRAM,8KX8,CMOS,DIP,28PIN,PLASTIC
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Utron Technology Inc
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SS-73500-005 |
12 PORT, 6 OVER 6 SHIELDED CAT 5 COMPRESSOR STACK JACK DEPRESSED PLUG TAB VERSION, NO TOP OR BOT PANEL GRDS
|
Bel Fuse Inc.
|
M36W216BI70ZA1T M36W216TI70ZA1T M36W216TI85ZA1T M3 |
16 Mbit 1Mb x16, Boot Block Flash Memory and 2 Mbit 128Kb x16 SRAM, Multiple Memory Product 16 MBIT (1MB X16, BOOT BLOCK) FLASH MEMORY AND 2 MBIT (128K X16) SRAM, MULTIPLE MEMORY PRODUCT 16 Mbit 1Mb x16 / Boot Block Flash Memory and 2 Mbit 128Kb x16 SRAM / Multiple Memory Product
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ST Microelectronics
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AM29LV001BB-45RFI AM29LV001BB-45RFIB AM29LV001BB-4 |
1 Megabit (128 K x 8-Bit) CMOS 3.0 Volt-only Boot Sector Flash Memory 1兆位28亩8位)的CMOS 3.0伏,只引导扇区闪 1 Megabit (128 K x 8-Bit) CMOS 3.0 Volt-only Boot Sector Flash Memory 128K X 8 FLASH 3V PROM, 55 ns, PDSO32 64KX16,TSOP(II)44,IND,SRAM
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http:// Advanced Micro Devices, Inc.
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A81L801 A81L801UG-70F A81L801TG-70F |
Stacked Multi-chip Package (MCP) 1 M X 8 Bit / 512K X 16 Bit Boot Sector Flash Memory and 128K x 8 Low Voltage CMOS SRAM
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AMIC Technology Corporation
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UT6716455PPX UT6716470PPX UT6716455WCA UT6716470WC |
64K SRAM, 8Kx8. 55ns access time Lead finish optional. Prototype flow. 64K SRAM, 8Kx8. 70ns access time Lead finish optional. Prototype flow. 64K SRAM, 8Kx8. 55ns access time Lead finish solder. 64K SRAM, 8Kx8. 70ns access time Lead finish solder. 64K SRAM, 8Kx8. 85ns access time Lead finish solder.
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Aeroflex Circuit Technology
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M36W432-ZAT M36W432BZA M36W432T85ZA1T M36W432T85ZA |
32 Mbit 2Mb x16, Boot Block Flash Memory and 4 Mbit 256K x16 SRAM, Multiple Memory Product 32 MBIT (2MB X16, BOOT BLOCK) FLASH MEMORY AND 4 MBIT (256K X16) SRAM, MULTIPLE MEMORY PRODUCT
|
ST Microelectronics
|
LH28F160BJHE-BTL70 |
16M-BIT(1Mbit x16/2Mbit x8)Boot Block Flash MEMORY(16M1Mx16/2Mx8)Boot Block 闪速存储器)
|
Sharp Corporation
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M36W108 M36W108B M36W108B100ZM1T M36W108B100ZM5T M |
8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product From old datasheet system
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ST Microelectronics STMICROELECTRONICS[STMicroelectronics]
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