PART |
Description |
Maker |
HN62V454BCP-20 |
x8 or x16 ROM (Mask Programmable) x8或x16光盘(掩模可编程
|
TE Connectivity, Ltd.
|
LH532000BN-1 |
x8 or x16 ROM (Mask Programmable) x8或x16光盘(掩模可编程
|
Samsung Semiconductor Co., Ltd.
|
GM23V8100A-25 GM23V8100AFW-20 GM23V8100AFW-15 |
x8 or x16 ROM (Mask Programmable) x8或x16光盘(掩模可编程
|
Intel, Corp.
|
UPD23C128000LGY-XXX-MJ UPD23C128000LGY-XXX-MK |
XWAY ADM5120 x8 or x16 ROM (Mask Programmable) x8或x16光盘(掩模可编程
|
NEC, Corp.
|
UPD23C64040ALGY-XXX-MK UPD23C64040ALGY-XXX-MJ |
HiRel Silicon Diodes; Package: --; Package: -; IF (max): -; VBR (min): -; rF (typ): -; CT (max): - x8 or x16 ROM (Mask Programmable) x8或x16光盘(掩模可编程
|
NEC, Corp.
|
MSM66P56-XX MSM66P54-XX MSM6650 MSM6656A MSM6656-X |
Internal Mask ROM Voice Synthesis IC, Internal One-Time-Programmable (OTP) ROM
|
OKI
|
UPD23C1000A |
Mask Programmable CMOS ROM
|
NEC Electronics
|
UPD23C1010A |
Mask Programmable CMOS ROM
|
NEC Electronics
|
LC378100PM-20LV |
x8 ROM (Mask Programmable) x8光盘(掩模可编程
|
Artisan Controls, Corp.
|
AM27X100-300PC AM27X100-150XC AM27X100-150PC AM27X |
x8 ROM (Mask Programmable) x8光盘(掩模可编程
|
TE Connectivity, Ltd. Advanced Micro Devices, Inc. NXP Semiconductors N.V.
|
LH53259M-15 |
x8 ROM (Mask Programmable) x8光盘(掩模可编程
|
Black Box, Corp.
|
AM27X080-120JI AM27X080-120JC AM27X080-120PI AM27X |
x8 ROM (Mask Programmable) x8光盘(掩模可编程
|
TUSONIX, Inc.
|