| PART |
Description |
Maker |
| 10-FZ122PA075SC01-P998F18 |
AlN substrate for improved performance
|
Vincotech
|
| ICS87946I-147 |
Low Skew, ÷1, ÷2 Clock Generator. Industrial Temp. Improved performance.
From old datasheet system
|
ICS
|
| ICS853011C |
Low Skew, 1-to-2, Differential-to-LVPECL Fanout Buffer. Improved Performance. Industrial Temperature.
|
ICS
|
| SB1H100-E3_54 SB1H100-E3_73 SB1H100 SB1H100HE3_54 |
High-Voltage Schottky Rectifier High Barrier Technology for Improved High Temperature Performance
|
Vishay Siliconix
|
| SB3H100-E3_54 SB3H100-E3_73 SB3H90 SB3H9008 SB3H10 |
High-Voltage Schottky Rectifier High Barrier Technology for Improved High Temperature Performance
|
Vishay Siliconix
|
| 473921001 0473921001 |
1.27mm (.050) Pitch External Improved Metal-Shielded Serial ATA Plug, Through Hole, Right Angle, Gold Flash, Unmating Height 7.70mm (.303), Black, Inline Plastic Pegs
|
Molex Electronics Ltd.
|
| U3665M U3665M-MDP U3665M-MFP |
SPECIALTY CONSUMER CIRCUIT, PDIP16
Baseband Delay Line 64 us (Improved Version)
Baseband Delay Line 0.064 ms (Improved Version)
|
TEMIC[TEMIC Semiconductors]
|
| SS-73100-029 |
HIGH PERFORMANCE SHIELDED STACK JACK EIGHT CONTACT, EIGHT POSITION 50 MICRO INCHES GOLD 16PORTS (8 ON 8)
|
Bel Fuse Inc.
|
| H3184-05 |
PC Board Socket for 1.00mm Pin, gold clip gold shell BRASS, GOLD (4) FINISH, PCB TERMINAL
|
Harwin PLC
|
| U3666M U3666M-MFP U3666M-MDP |
Baseband Delay Line o.o64 ms (Improved Version of U3665M)
Baseband Delay Line 64 xs (Improved Version of U3665M)
Baseband Delay Line 64 us (Improved Version of U3665M)
|
Atmel
TEMIC[TEMIC Semiconductors]
|
| M80-0550005 |
Datamate J-Tek 3-Row (M80-7XX series) Female Crimp Contact, gold clip gold shell BERYLLIUM COPPER, GOLD FINISH, WIRE TERMINAL
|
Harwin PLC
|
