| PART |
Description |
Maker |
| LCM-S01602DSF-A SCM-S01602DSFA |
TRANSFLECTIVE
5.56mm CHARACTER HEIGHT, 5 x 8 DOT MATRIX, STN, TRANSFLECTIVE WITH LED BAKLIGHT, 16 x 2 LCD MODULE, 1/16 DUTY, 1/5 BIAS
|
LUMEX INC.
|
| HEDM-65XX |
Large Diameter (56mm),Housed Two and Three Channel Optical Encoders(大的直径(56mm),含有两个和三个通道的光编码
|
Agilent(Hewlett-Packard)
|
| RT240128ASR RT240128ASRL |
1/64Duty 1/9 Bias Gray mode STN Transflective
|
List of Unclassifed Manufacturers
ETC
|
| RCM7011T |
20 Characters x 2 lines Transflective Character Module(20字符 x 2线LCD模块)
|
Rohm CO.,LTD.
|
| BO9864B |
FSTN Transflective LCD, COG package Built-in driver ST7548i, serial I2C data bus
|
Bolymin, Inc
|
| 0440671001 44067-1001 |
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140")
MOLEX Connector
|
Molex Electronics Ltd.
|
| 146322-1 |
PC Card ( PCMCIA ) Connectors & Accessories; 68 MEMCD RCPT SMT/56MM TAPE ( AMP )
|
Tyco Electronics
|
| 44067-0403 0440670403 |
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 4 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
3.00mm (.118") Pitch Micro-Fit 3.0垄芒 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 4 Circuits, 0.76楼矛m (30楼矛") Gold (Au) Selectiv
|
Molex Electronics Ltd.
|
| 0440671403 44067-1403 |
3.00mm (.118) Pitch Micro-Fit 3.0?/a> Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 14 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 14 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
3.00mm (.118") Pitch Micro-Fit 3.0垄芒 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 14 Circuits, 0.76楼矛m (30楼矛") Gold (Au) Selecti
MOLEX Connector
|
Molex Electronics Ltd.
|
| 44067-1601 0440671601 |
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140")
|
Molex Electronics Ltd.
|
|
