| PART |
Description |
Maker |
| TLE5009A16 |
Available as single die and dual die with separate supplies for each die
|
Infineon Technologies A...
|
| IRG4CC50WB |
IGBT Die in Wafer Form 600 V Size 5 WARP Speed
IRG4CC50WB IGBT Die in Wafer Form
|
Hittite Microwave Corporation
International Rectifier
|
| K4H560838E-TC/LB0 K4H560838E-TC/LA2 K4H560838E-TC/ |
DDR SDRAM 256Mb E-die (x4, x8) 256Mb的DDR SDRAM的电子芯片（了x4，x8
Quad Wide Bandwidth High Output Drive Single Supply Op Amp 16-PDIP -40 to 125
256Mb E-die DDR SDRAM Specification 66 TSOP-II
Dual Micropower Precision Low-Voltage Operational Amplifier 8-SOIC -55 to 125
10-Bit, 32 kSPS ADC Serial Out, uProcessor Periph./Standalone, 11 Ch. 20-PLCC
10-Bit, 32 kSPS ADC Serial Out, uProcessor Periph./Standalone, 11 Ch. 20-PDIP
DDR SDRAM 256Mb E-die (x4, x8)
|
Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
|
| IRFP151 IRFP153 IRFP152 IRF150 IRF152 IRFP150 IRFC |
(IRFP150 - IRFP153) HIGH VOLTAGE POWER MOSFET DIE
(IRF150 - IRF153) HIGH VOLTAGE POWER MOSFET DIE
|
International Rectifier
IXYS[IXYS Corporation]
|
| MR18R162GAF0 MR16R162GAF0 MR18R1624AF0 MR18R1622AF |
64M X 16 RAMBUS MODULE, DMA184
TVS 500W 6.5V BIDIRECT DO-15 6Mx16显示）2/8/16）件RIMM的模块，基于256Mb阿芯片，32秒银行，16K/32ms参考，.5V
16Mx16显示）2/8/16）件RIMM的模块，基于256Mb阿芯片，32秒银行，16K/32ms参考，.5V
(MR18R1622(4/8/G)AF0) (16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die
(MR1xR1622(4/8/G)AF0) (16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die
(16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die, 32s banks,16K/32ms Ref, 2.5V
|
Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
|
| 0559320830 55932-0830 |
2.00mm (.079) Pitch MicroClasp Wire-to-Board Header, Single Row, Vertical, 8Circuits, without PCB Locator
2.00mm (.079") Pitch MicroClasp垄芒 Wire-to-Board Header, Single Row, Vertical, 8Circuits, without PCB Locator
MOLEX Connector
|
Molex Electronics Ltd.
|
| MURC520 |
MURC520 Ultrafast Silicon Die
MURC520 Ultrafast Silicon Die
|
Sensitron
|
| 87833-2421 0878332421 |
2.00mm (.079) Pitch Milli-Grid Header, Right Angle, Shrouded, Lead-free, 24 Circuits, 0.76μm (30μ) Gold (Au) Plating, without PCB Locator, with Locking Windows
2.00mm (.079) Pitch Milli-Grid垄芒 Header, Right Angle, Shrouded, Lead-free, 24 Circuits, 0.76楼矛m (30楼矛) Gold (Au) Plating, without PCB Locator, with Locking Wind
|
Molex Electronics Ltd.
|
| 0878333621 87833-3621 |
2.00mm (.079) Pitch Milli-Grid Header, Right Angle, Shrouded, Lead-free, 36 Circuits, 0.76μm (30μ) Gold (Au) Plating, without PCB Locator, with Locking Windows
2.00mm (.079) Pitch Milli-Grid垄芒 Header, Right Angle, Shrouded, Lead-free, 36 Circuits, 0.76楼矛m (30楼矛) Gold (Au) Plating, without PCB Locator, with Locking Wind
|
Molex Electronics Ltd.
|
| 55932-0530 0559320530 |
2.00mm (.079) Pitch MicroClasp Wire-to-Board Header, Single Row, Vertical, 5Circuits, without PCB Locator
2.00mm (.079") Pitch MicroClasp垄芒 Wire-to-Board Header, Single Row, Vertical, 5Circuits, without PCB Locator
|
Molex Electronics Ltd.
|
| 55932-0310 0559320310 |
2.00mm (.079) Pitch MicroClasp Wire-to-Board Header, Single Row, Vertical, 3Circuits, with PCB Locator
2.00mm (.079") Pitch MicroClasp垄芒 Wire-to-Board Header, Single Row, Vertical, 3Circuits, with PCB Locator
|
Molex Electronics Ltd.
|
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