| PART |
Description |
Maker |
| TSC607-ZPPACKOF10 TSC506-ZP |
IC FLEX 10KE FPGA 200K 600-BGA
780-pin FineLine BGA BEFESTIGUNGSKLAMMER多珀0ST
|
OSRAM GmbH
|
| PL00252-WCB08 |
SMD LED 1508 Package
|
P-tec Corporation
|
| ATS028028018-PF-9Q |
28.00 x 28.00 x 18.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Custom Pin Fin
|
Advanced Thermal Solutions, Inc.
|
| ATS040040010-PF-13I |
40.00 x 40.00 x 10.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Custom Pin Fin
|
Advanced Thermal Solutions, Inc.
|
| ATS037037017-PF-12P |
37.00 x 37.00 x 17.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Custom Pin Fin
|
Advanced Thermal Solutions, Inc.
|
| ATS010010010-PF-1I |
10.00 x 10.00 x 10.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Custom Pin Fin
|
Advanced Thermal Solutions, Inc.
|
| ATS037037010-PF-12I |
37.00 x 37.00 x 10.00 mm BGA Heat Sink (High Aspected Ratio Ext.) Custom Pin Fin
|
Advanced Thermal Solutions, Inc.
|
| ATS035035011-PF-11J |
35.00 x 35.00 x 11.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Custom Pin FIn
|
Advanced Thermal Solutions, Inc.
|
| ATS042042011-PF-14J |
42.00 x 42.00 x 11.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Custom Pin Fin
|
Advanced Thermal Solutions, Inc.
|
| ATS017017017-PF-5P |
17.00 x 17.00 x 17.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Custom Pin Fin
|
Advanced Thermal Solutions, Inc.
|
