PART |
Description |
Maker |
CL31C332FBFNNNE |
Multi-layer Ceramic Capacitor
|
Samsung semiconductor
|
CL31B472KBCNNNC |
Multi Layer Ceramic Capacitor (MLCC)
|
Samsung semiconductor
|
CL21B473KBCNNNC |
Multi Layer Ceramic Capacitor (MLCC)
|
Samsung semiconductor
|
CL21B683KBCNNNC |
Multi Layer Ceramic Capacitor (MLCC)
|
Samsung semiconductor
|
CL31B105KAHNNNE |
Multi Layer Ceramic Capacitor (MLCC)
|
Samsung semiconductor
|
MNA14 |
From old datasheet system Multi-layer ceramic chip capacitor networks
|
ROHM[Rohm]
|
CI100505-5N6D CI100505-R10J CI100505-8N2J CI100505 |
Multi-Layer Chip Inductors 1 ELEMENT, 0.0015 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Multi-Layer Chip Inductors 1 ELEMENT, 0.0022 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Multi-Layer Chip Inductors 1 ELEMENT, 0.068 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Multi-Layer Chip Inductors 1 ELEMENT, 0.082 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Multi-Layer Chip Inductors 1 ELEMENT, 0.0027 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
|
Bourns Inc. Bourns, Inc.
|
MCH022A4R7DK MCH02 MCH022A010CK MCH022A020CK MCH02 |
Multi-layer ceramic chip capacitors
|
ROHM[Rohm]
|
MCOTS-F-270-P-HT |
All capacitors are X7R multi-layer ceramic
|
SynQor Worldwide Headqu...
|
CDR11BP100AGYS CDR11BP101AGYS CDR11BP102AGYS CDR11 |
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.00001 uF, SURFACE MOUNT CHIP CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.0001 uF, SURFACE MOUNT CHIP CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.001 uF, SURFACE MOUNT CHIP CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.00075 uF, SURFACE MOUNT CHIP CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.000075 uF, SURFACE MOUNT CHIP CAP 2200PF 50V 5% X7R SMD-1111 WAFFLE-PAK BASE/BARR/SOLDER MICROWAVE R-MIL-PRF-55681 CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.0022 uF, SURFACE MOUNT
|
AVX, Corp.
|
HTA10 HTA12 HTA13 HTA11 |
(HTA10 - HTA14) High Voltage Commercial and Military Quality Multi-Layer Ceramic Capacitors
|
CalRamic
|
|