PART |
Description |
Maker |
M6MGT647M17AKT |
Memory>MCP(Multi Chip Package)>S-µMCP(Stacked micro MCP)
|
Renesas
|
WED2ZL361MSJ-BC WED2ZL361MSJ26BI WED2ZL361MSJ42BC |
NBL SSRAM MCP 1M X 36 MULTI DEVICE SRAM MODULE, 2.6 ns, PBGA119 1M X 36 MULTI DEVICE SRAM MODULE, 4.2 ns, PBGA119
|
WHITE ELECTRONIC DESIGNS CORP
|
AS5SS256K18DQ-10/IT AS5SS256K18DQ-10/XT AS5SS256K1 |
256K x 18 SSRAM - synchronous burst SRAM, flow-thru 256K x 18 SSRAM Synchronous Burst SRAM, Flow-Through 256K x 18 SSRAM Synchronous Burst SRAM. Flow-Through 256 × 18的SSRAM同步突发静态存储器。流通过
|
Austin Semiconductor, Inc
|
S73WS-P S75WS256NDGBFWLH2 S75WS256NDGBFWLH0 S75WS2 |
Stacked Multi-Chip Product (MCP) SPECIALTY MEMORY CIRCUIT, PBGA84 Stacked Multi-Chip Product (MCP) 堆叠式多芯片产品(MCP
|
Spansion Inc. Spansion, Inc.
|
AM50DLI28BG AM50DL128BG |
Am50DL128BG - Stacked Multi-Chip Package (MCP) Flash Memory and SRAM Am50DL128BG -堆叠式多芯片封装(MCP)闪存和SRAM
|
Advanced Micro Devices, Inc. Spansion, Inc.
|
PC755M8 PC755M8VG300LE PC755M8VG350LE |
32-bit RISC PowerPC-based Multichip Module RISC microprocessor. 8 Mbits: 128K x 72 SSRAM. Core frequency: 300 MHz/150 L2 cache. RISC microprocessor. 8 Mbits: 128K x 72 SSRAM. Core frequency: 350 MHz/175 MHz L2 cache.
|
Atmel
|
S72WS-N S72WS512NEG-LY S72WS512NFG-LY S72WS512NFG- |
Based MCP/PoP Products 基于MCP流行产品 Based MCP/PoP Products SPECIALTY MEMORY CIRCUIT, PBGA137
|
Spansion Inc. Spansion, Inc.
|
AS5SS256K36DQ-8.5_XT AS5SS256K36 AS5SS256K36A AS5S |
256K x 36 SSRAM Flow-Through, Synchronous Burst SRAM
|
AUSTIN[Austin Semiconductor]
|
AS5SS256K18DQ-8IT |
256K x 18 SSRAM Synchronous Burst SRAM, Flow-Through
|
Austin Semiconductor, Inc
|
AS5SS128K36DQ-11/IT AS5SS128K36DQ-11/XT AS5SS128K3 |
128K x 36 SSRAM - synchronous ZBL SRAM flow-thru output 128K x 36 SSRAM SYNCHRONOUS ZBL SRAM FLOW-THRU OUTPUT
|
Austin Semiconductor
|
AM49DL320BGB701T AM49DL320BGT701T AM49DL320BGT701S |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous 堆叠式多芯片封装(MCP)闪存和SRAM2兆位个M × 8 2米x 16位).0伏的CMOS只,同时 Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous 堆叠式多芯片封装(MCP)闪存和SRAM2兆位4个M × 8 2米x 16位).0伏的CMOS只,同时 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 32 Mbit (2M x 16-Bit) Pseudo Static RAM SPECIALTY MEMORY CIRCUIT, PBGA73
|
Spansion, Inc. Spansion Inc. ADVANCED MICRO DEVICES INC Advanced Micro Devices, Inc.
|