| PART |
Description |
Maker |
| QEN101 |
Ceramic SMID Packaged
|
Temex Components
|
| TC2182 |
Low Noise Ceramic Packaged PHEMT GaAs FETs
|
Transcom, Inc.
|
| ACT845SMX-2 |
2 pad, cost competitive ceramic packaged, glass sealed crystal.
|
Advanced Crystal Technology
|
| 5082-0132 5082-0335 |
1.5pF Capacitance Varactor Diode
Ceramic Packaged Step Recovery Diodes
|
Hewlett-Packard / Agilent
|
| QESM06 |
SMD 4.0x2.5 Crystal - Ceramic SMD packaged
|
TEMEX
|
| TGB2010-EPU-SM TGB2010-00-EPU-SM TGB2010-50-EPU-SM |
5 - 9 GHz packaged Bessel filter
5GHz - 9GHz Packaged Bessel Filter
|
TRIQUINT[TriQuint Semiconductor]
|
| AM2971ALCB AM2971ALE AM2971DE AM2971DC AM2971A/BJA |
High and Low Side Driver, Shutdown Input in a 14-pin DIP package; A IR2112 packaged in a Lead-Free 16-Lead SOIC
User Programmable Special Function ASIC
High and Low Side Driver, Shutdown Input in a 14-pin DIP package; A IR2112 packaged in a 16-Lead SOIC
High and Low Side Driver, Shutdown Input in a 14-pin DIP package; A IR2112 packaged in a Lead-Free 14-Lead PDIP
High and Low Side Driver, Shutdown Input in a 14-pin DIP package; A IR2112 packaged in a 14-Lead PDIP
High and Low Side Driver, All High Voltage Pins On One Side, Separate Logic and Power Ground, Shut-Down in a 14-pin DIP package; A IR2110 packaged in a Lead-Free 16-Lead PDIP -2 Lead
High and Low Side Driver, All High Voltage Pins On One Side, Separate Logic and Power Ground, Shut-Down in a 14-pin DIP package; A IR2110 packaged in a 14-Lead PDIP
Half Bridge Driver, Soft Turn-On, All High Voltage Pins on One Side, Separate High and Low Side Inputs, Programmable 0.5-5us Deadtime in a 14-pin DIP package; A IR21084 packaged in a Lead-Free 14-Lead SOIC
3 Phase Driver, Separate High and Low Side Inputs, 200ns Deadtime in a 28-pin DIP package; A IR2135 packaged in a Lead-Free mod. 44-Lead PLCC
用户可编ASIC的特殊功
3 Phase Driver, Separate High and Low Side Inputs, 200ns Deadtime in a 28-pin DIP package; A IR2135 packaged in a 28-Lead SOIC 用户可编程ASIC的特殊功
|
Amphenol, Corp.
|
| KV1913A KV1933A KV1973A KV2143 KV2153 GC1303 KV212 |
ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES
ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES C BAND, SILICON, HYPERABRUPT VARIABLE CAPACITANCE DIODE
ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES C BAND, 1.8 pF, SILICON, ABRUPT VARIABLE CAPACITANCE DIODE
OPTOCOUPLER 10MBPS OC 5-SOP
Tuning Varactors
|
Microsemi, Corp.
MICROSEMI[Microsemi Corporation]
|
| CGB7011-SC07 CGB7011-SC PB-CGB7011-SC-0000 CGB7011 |
DC-6.0 GHz InGaP HBT, MMIC or Packaged, Matched Gain Block Amplifier 0 MHz - 6000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER
DC-6.0 GHz InGaP HBT Packaged Matched Gain Block Amplifier
|
Mimix Broadband, Inc.
|
| CGB7010-SC07 CGB7010-SC PB-CGB7010-SC-0000 CGB7010 |
DC-6.0 GHz InGaP HBT, MMIC or Packaged, Matched Gain Block Amplifier 0 MHz - 6000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER
DC-6.0 GHz InGaP HBT Packaged, Matched Gain Block Amplifier
|
Mimix Broadband, Inc.
|
| CGB7009-SC07 CGB7009-SC PB-CGB7009-SC-0000 CGB7009 |
DC-6.0 GHz InGaP HBT, MMIC or Packaged, Matched Gain Block Amplifier 0 MHz - 6000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER
DC-6.0 GHz InGaP HBT Packaged Matched Gain Block Amplifier
|
Mimix Broadband, Inc.
|
