| PART |
Description |
Maker |
| HM51W17805B HM51W17805BJ-8 HM51W17805BLJ-8 HM51W17 |
Plastic internal molding, Noise prevention, Small and lightweight interface; HRS No: 112-3355-0 71; Contact Mating Area Plating: Tin
2097152-word*8-bit Dynamic random access memory
|
Hitachi,Ltd.
|
| HM514265DLJ-5 HM514265DLJ-7 HM514265DJ-6R HM514265 |
x16 EDO Page Mode DRAM
Plastic internal molding, Noise prevention, Small and lightweight interface; HRS No: 112-0076-0 71; Contact Mating Area Plating: Tin x16 EDO公司页面模式的DRAM
|
Cinch Connectors
|
| RPM6937-V4 RPM6938-V4 |
Lead Frame Remote Control Receiver Modules (5V with superior anti-nois characteristics Type)
|
ROHM
|
| FMG2G300US60E |
600V, 300A IGBT Module (Molding Type)
Molding Type Module
|
Fairchild Semiconductor
|
| FMG2G400LS60 |
600V, 400A IGBT Module (Molding Type)
Molding Type Module
|
Fairchild Semiconductor
|
| FMG2G300LS60E |
600V, 300A IGBT Module (Molding Type)
Molding Type Module
|
Fairchild Semiconductor
|
| A623308AV-70SF A623308AV-70SIF A7623L-S08-T A62330 |
2×75?/a> DRIVER IC WITH 3 INTERNAL CIRCUITS
2×75 DRIVER IC WITH 3 INTERNAL CIRCUITS
2】75з DRIVER IC WITH 3 INTERNAL CIRCUITS
25з DRIVER IC WITH 3 INTERNAL CIRCUITS
8K X 8 BIT CMOS SRAM 8K的8位CMOS的SRAM
|
UTC[Unisonic Technologies]
AMICC[AMIC Technology]
友顺科技股份有限公司
AMIC Technology Corporation
AMIC Technology, Corp.
|
| MHSC MHSC04020-R47M-R8 MHSC06022-2R2M-R8 MHSC06022 |
Molding Power Choke
|
List of Unclassifed Manufacturers
List of Unclassifed Man...
|
| SDM119N-1R1MF SDM119N-1R2MF SDM119N-2R0MF SDM119N- |
MOLDING TYPE DIP INDUCTORS
|
http://
Superworld Electronics
|
| D3SB60 D3SB100 D3SB20 D3SB40 D3SB80 |
Molding Single-Phase Bridge Rectifier
|
SeCoS Halbleitertechnologie GmbH
SeCoS Halbleitertechnol...
|
| D10SB10 D10SB100 D10SB80 D10SB40 D10SB20 D10SB60 R |
Molding Single-Phase Bridge Rectifier
|
SeCoS Halbleitertechnologie GmbH
SeCoS Halbleitertechnol...
|
| FMG1G300US60H |
600V, 300A IGBT Module (Molding Type)
|
Fairchild Semiconductor
|
