| PART |
Description |
Maker |
| LH5316500N-15 LH5316500T-15 |
x8 or x16 ROM (Mask Programmable) x8或x16光盘（掩模可编程
|
Ecliptek, Corp.
|
| LH532000BN-15 LH532000BTR-15 LH532000BT-12 |
x8 or x16 ROM (Mask Programmable) x8或x16光盘（掩模可编程
|
Samsung Semiconductor Co., Ltd.
|
| AM27X2048-200XC AM27X2048-205XC AM27X2048-155JC AM |
x16 ROM (Mask Programmable) x16光盘（掩模可编程
|
Advanced Micro Devices, Inc.
|
| MX23C1024-25SC |
x16 ROM (Mask Programmable) x16光盘（掩模可编程
|
Amphenol, Corp.
|
| UPD23C32000AGY-XXX-MJH UPD23C32000AGY-XXX-MKH UPD2 |
x8 or x16 ROM (Mask Programmable)
HITFET, TEMPFET - Smart Low-Side Switches x8或x16光盘（掩模可编程
|
NEC, Corp.
|
| UPD703100AGJ-33-UEN UPD703100GJ-33-UEN UPD703101AG |
ROM-less version; Internal RAM: 4K bytes
Mask ROM version; Mask ROM: 96K bytes; Internal RAM: 4K bytes
Mask ROM version; Mask ROM: 128K bytes; Internal RAM: 4K bytes
Flash version; Internal flash: 128K bytes; Internal RAM: 4K bytes
32-bit RISC microcontroller (V850E/MS2:ROMless,Internal RAM: 4 KB)
|
NEC
|
| MX23L6410YC-10 |
64M-BIT (8M x 8 / 4M x 16) Mask ROM 4M X 16 MASK PROM, 100 ns, PDSO44
|
Macronix International Co., Ltd.
|
| MX23L1610 MX23L1610MC-10 MX23L1610MC-12 MX23L1610M |
3.3 Volt 16-Mbit (2M x 8 / 1M x 16) Mask ROM 1M X 16 MASK PROM, 150 ns, PDSO44
|
PROM
Macronix International Co., Ltd.
|
| MX23L6422 MX23L6422MC-11 MX23L6422MC-12 MX23L6422Y |
3.3 Volt 64M-BIT (4M x 16 / 2M x 32) Mask ROM with Page Mode 2M X 32 MASK PROM, 120 ns, PDSO86
|
Macronix International Co., Ltd.
|
| MX23C8100 MX23C8100MC-10 MX23C8100MC-12 MX23C8100M |
8M-BIT MASK ROM (8/16 BIT OUTPUT) 512K X 16 MASK PROM, 150 ns, PDSO44
|
Macronix International Co., Ltd.
MCNIX[Macronix International]
|
| MSM66P56-XX MSM66P54-XX MSM6650 MSM6656A MSM6656-X |
Internal Mask ROM Voice Synthesis IC, Internal One-Time-Programmable (OTP) ROM
|
OKI
|
