| PART |
Description |
Maker |
| F1740-1511/1411 |
Class X1, AC275V
|
Vishay
|
| FH25-51S-0.3SH FH25-21S-0.3SH FH25-27S-0.3SH FH25- |
0.3 mm Contact Pitch/ 0.9 mm above the board/ Flexible Printed Circuit ZIF Connectors.
MS3108A16-11S
0.3 mm Contact Pitch, 0.9 mm above the board, Flexible Printed Circuit ZIF Connectors. 联系间距0.3毫米0.9以上的电路板，柔性线路板中频连接毫米
|
http://
HIROSE[Hirose Electric]
Hirose Electric USA, INC.
HIROSE ELECTRIC Co., Ltd.
|
| TDA8920C09 TDA8920C TDA8920CJ TDA8920CTH TDA8920CJ |
2 垄楼 110 W class-D power amplifier
2 麓 110 W class-D power amplifier
2 ′ 110 W class-D power amplifier
2 x 110 W class-D power amplifer, SOT411-1 (DBS23P), Tube 110 W, 2 CHANNEL, AUDIO AMPLIFIER, PZFM23
2 X 110 W class-D power amplifier
2 ′ 110 W class-D power amplifier
2 X 110 W class-D power amplifier
|
NXP Semiconductors N.V.
|
| APA2606NAI-TRG APA2606NI-TRG |
2.8W Stereo Class-D Audio Power Amplifier and Class AB Headphone Driver
|
Anpec Electronics Coropration
|
| MPR7000 |
EPC Class 0/1 and 0 in PCMCIA Type II Pkg. 的EPC Class 0 / 1和II型PCMCIA包装0
|
Electronic Theatre Controls, Inc.
|
| FAB2210UCX |
Audio Subsystem with Class-G Headphone and 3.3W Mono Class-D Speaker with Dynamic Range Compression
|
Fairchild Semiconductor
|
| MRF6S20010N MRF6S20010NR1 MRF6S20010GNR1 |
RF Power Field Effect Transistors
The MRF6S20010NR1 and MRF6S20010GNR1 are designed for Class A or Class AB general purpose applications
|
Freescale Semiconductor, Inc
MOTOROLA
|
| SKPC22/2 |
PRINTED CIRCUIT BOARD
|
Semikron International
|
| 36.404 |
MINI PLUGGABLE PRINTED CIRCUIT
|
Altech corporation
|
| E3S-LS3N E3S-LS3NW |
Printed Circuit Board Sensor
|
Omron Electronics LLC
|
