| PART |
Description |
Maker |
| 8XC251TP 8XC251SP 8XC251TA 8XC251SB 8XC251SQ 8XC25 |
Hardware Description
|
Intel Corporation
|
| FCPF11N60T |
General Description
|
Fairchild Semiconductor
|
| AOWF12N60 AOWF12N60L |
Marking Description
|
Alpha & Omega Semiconductors
|
| STA-6033 |
Product Description
|
List of Unclassifed Manufacturers
Sirenza Microdevices
ETC[ETC]
Electronic Theatre Controls, Inc.
|
| I7070 |
General Description
|
Taiwan Memory Technolog...
|
| M14C16DD M14C16-DD |
M14C16 Die Description
|
SGS Thomson Microelectronics
STMICROELECTRONICS[STMicroelectronics]
|
| AN1235 |
package description and recommendations for use
|
STMicroelectronics
|
| TMS27PC512-12DDE TMS27PC512-12DDE4 TMS27PC512-10DU |
PLCC Clip-on Adapters; Top Pin Count: 32; Bottom Pin Count: 32; Part Description: PLCC IC Clip;
Diamond Particle Interconnect GHz MLF/QFN Sockets; Top Pitch (mm): 0.5; IC Size X (mm): 4; IC Size Y (mm): 4; Socket Lid: Swivel; Max Pincount: 20; Part Description: Diamond GHz QFN/MLF Socket (ZIF);
Diamond Particle Interconnect GHz MLF/QFN Sockets; Top Pitch (mm): 0.65; IC Size X (mm): 6; IC Size Y (mm): 6; Socket Lid: Swivel; Max Pincount: 28; Part Description: Diamond GHz QFN/MLF Socket (ZIF);
x8 EPROM x8存储
FPGA Development: XILINX; Top Pin Count: 84; Bottom Pin Count: 84; Top Interface: PLCC SOCKET; Bottom Interface: PLCC PLUG; Device Specific: yes; Devices Supported: XC3020, 3030, 3042; Part Description: Xilinx FPGA adapter; x8存储
|
Maxim Integrated Products, Inc.
Clare, Inc.
TE Connectivity, Ltd.
|
| AOI4286L |
TO247 PACKAGE MARKING DESCRIPTION
|
Alpha & Omega Semiconductors
|
| AOV15S60 |
DFN8X8 PACKAGE MARKING DESCRIPTION
|
Alpha & Omega Semiconductors
|
| AOK60B60D1L |
TO247 PACKAGE MARKING DESCRIPTION
|
Alpha & Omega Semiconductors
|
| AOK20B60D1 AOK20B60D1L |
TO247 PACKAGE MARKING DESCRIPTION
|
Alpha & Omega Semiconductors
|
