| PART |
Description |
Maker |
| F9469PC F9460PC F9473PC |
VHB Adhesive Transfer Tapes with Adhesive 100MP
|
3M Electronics
|
| MPC603EFE100LX MPC603EFE133LX MPC603EEC |
MPC603e RISC Microprocessor Family PID6-603e Hardware Specification Advance Information
32-BIT, 133 MHz, RISC PROCESSOR, CQFP240 32 X 32 MM, 0.50 MM PITCH, WIRE BOND, CERAMIC, QFP-240
32-BIT, 100 MHz, RISC PROCESSOR, CQFP240 32 X 32 MM, 0.50 MM PITCH, WIRE BOND, CERAMIC, QFP-240
|
Motorola Mobility Holdings, Inc.
|
| TT190N16SOF |
Solder-Bond Technology
|
Infineon Technologies A...
|
| TT160N16SOF |
Solder-Bond Technology
|
Infineon Technologies A...
|
| MA4BPS201 MA4BPS301 MA4BPS101 |
PIN Diode Chips with Offset Bond Pads
|
MACOM[Tyco Electronics]
|
| ABM3H-A |
ADHESIVE BACKED MOUNT
|
PANDUIT CORP.
|
| XU66129.00 |
Developmental Monolayer Adhesive Film
|
Electronic Theatre Controls, Inc.
|
| XU66129.00 |
Developmental Monolayer Adhesive Film
|
List of Unclassifed Manufacturers
ETC[ETC]
|
| 9890 9882 9885 |
3M Thermally Conductive Adhesive Transfer Tapes
|
3M Electronics
|
| 561-SP13037 561-DP13037 |
Adhesive Backed Nylon Cable Clips
|
List of Unclassifed Manufacturers
List of Unclassifed Manufac...
|
| ATM-0007 ATM-0018 ATM-0020 ATM-0031 ATM-0052 ATM-0 |
ELECTRICALLY CONDUCTIVE DIE ATTACH ADHESIVE
|
List of Unclassifed Manufacturers
ETC
|
| CGAT |
Adhesive lined polyolefin heat-shrinkable tubing
|
MACOM[Tyco Electronics]
|
