| PART |
Description |
Maker |
| A82DL16X4TU |
Stacked Multi-Chip Package
|
AMIC Technology
|
| AM41DL32X4G |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
SPANSION
|
| AM49DL640AG85IT |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
Advanced Micro Devices
|
| A82DL1622T |
(A82DL16x2T) Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
AMIC Technology
|
| AM70PDLI29BDH |
(AM70PDLI27BDH / AM70PDLI29BDH) Stacked Multi-Chip Package (MCP/XIP) Flash Memory
|
SPANSION
|
| S71NS032JA0BJWRT0 S71NS032J80BJWRA |
Stacked Multi-Chip Product (MCP) SPECIALTY MEMORY CIRCUIT, PBGA56
Stacked Multi-Chip Product (MCP) 堆叠式多芯片产品（MCP
|
Spansion, Inc.
|
| AM45DL3208GT70IS AM45DL3208GT85IS AM45DL3208GT70IT |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
Advanced Micro Devices, Inc.
ADVANCED MICRO DEVICES INC
|
| M6MGE13VW66CWG |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
|
Renesas
|
| M6MGE13VW34DWG |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
|
Renesas
|
| M6MGD13TW34DWG-P |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
|
Renesas
|
| AM49DL640BG25IS AM49DL640BG25IT AM49DL640BG35IS |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 堆叠式多芯片封装（MCP）闪存和SRAM
|
Spansion, Inc.
Spansion Inc.
Advanced Micro Devices
|
