| PART |
Description |
Maker |
| IDT77V107 IDT77V107L25PF IDT77V107L25PFI |
3.3V ATM PHY for 25.6 and 51.2 Mbps Applications with UTOPIA level 2 Interface
Single ATM PHY for 25.6 and 51.2 Mbps with Utopia Level 2
|
IDT[Integrated Device Technology]
|
| MC-ACT-HDLC-NET MC-ACT-HDLC-VHDL MC-ACT-HDLC-VLOG |
FPGA, XMA
UTOPIA Level 3 PHY
|
Actel Corporation
|
| IDT77V011L155DA IDT77V011 |
Data Path Interface to Utopia Level 2 Translation Device
|
Electronic Theatre Controls, Inc.
List of Unclassifed Manufacturers
|
| IDT77V1264 |
Quad port ATM 200 Mbps backplane PHY with 16-bit UTOPIA-2 and 8-bit UTOPIA-1 interfaces.
|
IDT
|
| 28222-13 CN8223 28233-11 BT8222EPFF |
ATM Transmitter/Receiver with UTOPIA Interface
|
Conexant Systems, Inc.
|
| ST20196 |
ADSL2 UTOPIA DMT TRANSCEIVER FOR CPE APPLICATIONS
|
ST Microelectronics
|
| ST20196 ST20184 ST20190 |
ADSL, ADSL2 and ADSL Modem Chipset for CPE Applications with Utopia II Interface
ADSL, ADSL2 and ADSL Modem Chipset fro CPE Applications with Utopia II Interface
|
意法半导
STMICROELECTRONICS[STMicroelectronics]
ST Microelectronics
|
| AD567JD/ AD567KD AD6521 AD6521ACA AD6482JST AD6482 |
12-Bit Current Output, Microprocessor-Compatible DAC
GSM Voiceband/Baseband Codec
Eagle UTOPIA
|
Analog Devices
|
| FCD4B14NBSP FCD4B14 FCD4B14CC FCD4B14CCB |
500 dpi, 0.4mm x 14 mm Digital Fingerprint Linear Sensor, 2240 Pixels (8 x 280) Image Array, Digital
|
ATMEL Corporation
|
| ADG3232 ADG3232BRJ-REEL7 ADG3232BRJ-REEL |
2:1 Multiplexer Level Translator with Bi-directional 1.65 V to 3.6 V Level Shift
Low Voltage 2-1 Mux, Level Translator
From old datasheet system
|
AD[Analog Devices]
|
| S5N8951 S5N8947 S5N8950 |
1 Port ADSL Transceiver W/PCI
ARM7TDMI 72MHz,H/W SAR,UTOPIA L1/2,USB,2 Ethernet MAC
Full Rate(G.dmt/G.lite) dmt Transceiver for CO/CPE
|
Samsung
|
| PL342 PL34120191000GDDC PL34120191000KKEX PL341201 |
High Sensitivity Chip Sensors Sideview Type; Type: Sideview Resin; Peak sensitivity wavelength P (nm): 800; Viewing angle 1/2 (deg): ±14; Dark
Infrared Light Emitting Diodes Top View Type; Type: Surface Mount Type (Sideview); Peak light emitting wavelength P (nm): 950; Half viewing angle
Infrared Light Emitting Diodes Top View Type; Type: Sideview Resin; Peak light emitting wavelength P (nm): 950; Half viewing angle 1/2 (deg): ±
High Sensitivity Chip Sensors Sideview Type; Type: Sideview Resin; Peak sensitivity wavelength P (nm): 800; Viewing angle 1/2 (deg): ±32; Dark
Printheads for Packaging High-Speed Printers; Resolutions (dpi): 203; Print width (mm): 56; Resistance tolerance (O): 550; Platen diameter (max.)(f): 50; Print speed (mm/s): 100 to 300; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Printheads for Distribution or Food Labels; Resolutions (dpi): 203; Print width (mm): 112; Resistance tolerance (O): 550; Platen diameter (max.)(f): 20; Print speed (mm/s): 100 to 300; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Fast Recovery Diodes; Mounting style: Leaded type; Package size: 3.0x2.5(t=2.5); Number of terminal: 2; Reverse voltage VR(V): 200; Average rectified forward current IO(A): 1;
Schottky Barrier Diodes; Package: TO220FN; Constitution materials list: Packing style: Bulk; Package quantity: 500;
Printheads for Distribution or Food Labels; Resolutions (dpi): 300; Print width (mm): 108.4; Resistance tolerance (O): 850; Platen diameter (max.)(f): 20; Print speed (mm/s): 100 to 250; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Printheads for Distribution or Food Labels; Resolutions (dpi): 300; Print width (mm): 81.3; Resistance tolerance (O): 850; Platen diameter (max.)(f): 20; Print speed (mm/s): 100 to 250; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Printheads for Distribution or Food Labels; Resolutions (dpi): 203; Print width (mm): 56; Resistance tolerance (O): 550; Platen diameter (max.)(f): 20; Print speed (mm/s): 100 to 300; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Printheads for Distribution or Food Labels; Resolutions (dpi): 300; Print width (mm): 54.2; Resistance tolerance (O): 850; Platen diameter (max.)(f): 20; Print speed (mm/s): 100 to 250; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Fast Recovery Diodes; Mounting style: Surface mount; Package size: 2.6x1.6(t=0.8); Number of terminal: 2; Reverse voltage VR(V): 200; Average rectified forward current IO(A): 0.7;
Fast Recovery Diodes; Mounting style: Surface mount; Package size: 1.9x1.3(t=0.6); Number of terminal: 2; Reverse voltage VR(V): 100; Average rectified forward current IO(A): 0.5;
Printheads for Packaging High-Speed Printers; Resolutions (dpi): 300; Print width (mm): 54.2; Resistance tolerance (O): 850; Platen diameter (max.)(f): 50; Print speed (mm/s): 100 to 300; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Printheads for Packaging High-Speed Printers; Resolutions (dpi): 203; Print width (mm): 112; Resistance tolerance (O): 550; Platen diameter (max.)(f): 50; Print speed (mm/s): 100 to 300; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Printheads for Packaging High-Speed Printers; Resolutions (dpi): 300; Print width (mm): 108.4; Resistance tolerance (O): 850; Platen diameter (max.)(f): 50; Print speed (mm/s): 100 to 300; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
High Sensitivity Chip Sensors Sideview Type; Type: Surface Mount Type; Peak sensitivity wavelength P (nm): 800; Viewing angle 1/2 (deg): ±12; Dark current ICEO (Max.)(µA): 0.5; Response time tr·tf (µA): 10; Yes;
Reflective Type Photosensors (Photoreflectors); Type: Cased Type; Light Emitting Diode: 630; Phototransistor: 600; Collector current IC (Min.)(mA): 0.08; Response time tr·tf (µs): 10;
Photointerrupter General Type; Packing style: Plastic bag; Package quantity: 400; 塑料无引线芯片载
Plastic Leadless Chip Carrier 塑料无引线芯片载
Printheads for Distribution or Food Labels; Resolutions (dpi): 203; Print width (mm): 80; Resistance tolerance (O): 550; Platen diameter (max.)(f): 20; Print speed (mm/s): 100 to 300; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24; 塑料无引线芯片载
Lead Frame Remote Control Receiver Modules (5V Type); Packing style: Stick; Package quantity: 1000; 塑料无引线芯片载
660/780nm Dual Wave Low Power Lasers; Packing style: Tray; Package quantity: 500; 塑料无引线芯片载
Fast Recovery Diodes; Mounting style: Leaded type; Package size: 15x10(t=4.5); Number of terminal: 3; Reverse voltage VR(V): 200; Average rectified forward current IO(A): 20; 塑料无引线芯片载
Fast Recovery Diodes; Mounting style: Leaded type; Package size: 15x10(t=4.5); Number of terminal: 3; Reverse voltage VR(V): 400; Average rectified forward current IO(A): 20; 塑料无引线芯片载
Fast Recovery Diodes; Mounting style: Surface mount; Package size: 5.5x6.5(t=2.3); Number of terminal: 3; Reverse voltage VR(V): 200; Average rectified forward current IO(A): 6;
|
Vishay Intertechnology,Inc.
Vishay Intertechnology, Inc.
|
