| PART |
Description |
Maker |
| MC-4R64CPE6C-845 MC-4R64CPE6C MC-4R64CPE6C-653 MC- |
DRAGONBALL MXL DIE SALE
Direct Rambus DRAM RIMM Module 64M-BYTE 32M-WORD x 16-BIT 直接Rambus的内存RIMM400模块技2M的字x 16
|
http://
NEC[NEC]
NEC Corp.
NEC, Corp.
|
| AT24C01B-TSU-T AT24C01BN-SH-T AT24C01B-TH-B AT24C0 |
DIE SALE, 1.8V, 11 MIL(SERIAL EE) 128 X 8 I2C/2-WIRE SERIAL EEPROM, UUC
|
聚兴科技股份有限公司
Atmel, Corp.
|
| TLE5009A16 |
Available as single die and dual die with separate supplies for each die
|
Infineon Technologies A...
|
| MR18R162GAF0 MR16R162GAF0 MR18R1624AF0 MR18R1622AF |
64M X 16 RAMBUS MODULE, DMA184
TVS 500W 6.5V BIDIRECT DO-15 6Mx16显示）2/8/16）件RIMM的模块，基于256Mb阿芯片，32秒银行，16K/32ms参考，.5V
16Mx16显示）2/8/16）件RIMM的模块，基于256Mb阿芯片，32秒银行，16K/32ms参考，.5V
(MR18R1622(4/8/G)AF0) (16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die
(MR1xR1622(4/8/G)AF0) (16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die
(16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die, 32s banks,16K/32ms Ref, 2.5V
|
Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
|
| SIDC03D30SIC2SAWN SIDC03D30SIC2UNSAWN |
Diodes - HV Chips - 300V, 10A die sawn
Diodes - HV Chips - 300V, 10A die unsawn
|
Infineon
|
| MURC620 |
MURC620 Ultrafast Silicon Die
MURC620 Ultrafast Silicon Die
|
http://
|
| 3606 3601 |
Die Cast Aluminum Box Painted, Size “D
Die Cast Aluminum Box Painted, Size 隆掳D隆卤
|
Pomona Electronics
|
| 11-40-2005 T8303A 1140-2005 0011-40-2005 001140-20 |
Terminator Die
|
Molex Electronics Ltd.
|
| 11-40-2042 1140-2042 0011-40-2042 |
Terminator Die
|
Molex Electronics Ltd.
|
| 11-40-2015 1140-2015 0011-40-2015 001140-2015 |
Terminator Die
|
Molex Electronics Ltd.
|
