| PART |
Description |
Maker |
| 87874-3002 0878743002 |
5.08mm (.200), 2.54mm (.100) Pitch Power, 2.54mm (.100) Pitch Signal, EXTreme PowerPlus Pa-S Header, Through Hole, Right Angle, Screw Mount
|
Molex Electronics Ltd.
|
| 0878746001 87874-6001 |
5.08mm (.200), 2.54mm (.100) Pitch Power, 2.54mm (.100) Pitch Signal, EXTreme PowerPlus?/a> Pa-S Header, Through Hole, Right Angle, Beveled Metal Pins
MOLEX Connector
|
http://
Molex Electronics Ltd.
|
| 0900590015 90059-0015 |
2.54mm (.100) Pitch C-Grid? Micro Shunt, Low Profile, Natural Housing
2.54mm (.100) Pitch C-Grid庐 Micro Shunt, Low Profile, Natural Housing
MOLEX Connector
|
Molex Electronics Ltd.
|
| 0900590013 90059-0013 |
2.54mm (.100) Pitch C-Grid? Micro Shunt, Low Profile, 35mm Pretinned Plating
2.54mm (.100) Pitch C-Grid庐 Micro Shunt, Low Profile, 35mm Pretinned Plating
MOLEX Connector
|
Molex Electronics Ltd.
|
| 0900590011 90059-0011 |
2.54mm (.100) Pitch C-Grid? Micro Shunt, Low Profile, 15mm Select Gold (Au) with Gold (Au) Flash Plating
2.54mm (.100) Pitch C-Grid庐 Micro Shunt, Low Profile, 15mm Select Gold (Au) with Gold (Au) Flash Plating
MOLEX Connector
|
Molex Electronics Ltd.
|
| 0900591009 90059-1009 |
2.54mm (.100) Pitch C-Grid? Micro Shunt, Low Profile, 15mm Select Gold (Au) with Gold (Au) Flash Plating
2.54mm (.100) Pitch C-Grid庐 Micro Shunt, Low Profile, 15mm Select Gold (Au) with Gold (Au) Flash Plating
MOLEX Connector
|
Molex Electronics Ltd.
|
| 22-17-2127 A-4455-BH12J 0022172127 |
2.54mm (.100) Pitch KK? PC Board Connector, Bottom Entry, 0.80μm (30μ) Gold (Au), 12 Circuits
2.54mm (.100) Pitch KK庐 PC Board Connector, Bottom Entry, 0.80渭m (30渭) Gold (Au), 12 Circuits
2.54mm (.100) Pitch KK垄莽 PC Board Connector, Bottom Entry, 0.80楼矛m (30楼矛) Gold (Au), 12 Circuits
|
Molex Electronics Ltd.
|
| 14-56-8250 A-70400-3408 |
2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Female, Single Row, Version C, Front Ribs, Wire Size 22, 0.76μm (30μ) Gold (Au), 25 Circuits
2.54mm (.100") Pitch SL垄芒 Insulation Displacement Connector Assembly
|
Molex Electronics Ltd.
|
| 71764-0104 |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 4 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 4 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 70247-3054 0702473054 |
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded30 Circuits, 0.127μm (5μ) Gold (Au) Plating, Tin(Sn) PC TailPlating
2.54mm (.100") Pitch C-Grid庐 Header, Dual Row, Low Profile, Right Angle, Shrouded30 Circuits, 0.127渭m (5渭") Gold (Au) Plating, Tin(Sn) PC TailPlating
|
Molex Electronics Ltd.
|
| 70247-3051 0702473051 |
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded30 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
2.54mm (.100") Pitch C-Grid庐 Header, Dual Row, Low Profile, Right Angle, Shrouded30 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Platin
|
Molex Electronics Ltd.
|
|
