| PART |
Description |
Maker |
| C3216X7S2A225MT |
SPECIFICATION FOR TDK MULTILAYER CERAMIC CHIP CAPACITORS
|
TDK Electronics
|
| C3225X7S2A335KT |
SPECIFICATION FOR TDK MULTILAYER CERAMIC CHIP CAPACITORS
|
TDK Electronics
|
| CAK-001 CAK-001MF CAK-001AF CAK-2405F CAK-002AF CA |
TDK DC to DC Converters, DC to AC inverters
|
TDK[TDK Electronics]
|
| OPB16450UART |
This document provides the specification
DS433 August 18, 2004 Product Specification
|
Xilinx, Inc.
|
| 55PC2221 |
This specification sheet forms a part of the latest issue of Raychem Specification 55PC.
|
Tyco Electronics
|
| 55PC1133 |
This specification sheet forms a part of the latest issue of Raychem Specification 55PC.
|
Tyco Electronics
|
| 55PC0213 |
This specification sheet forms a part of the latest issue of Raychem Specification 55PC.
|
TE Connectivity Ltd
|
| 55PC1811 |
This specification sheet forms a part of the latest issue of Raychem Specification 55PC.
|
TE Connectivity Ltd
|
| 55PC7000 |
This specification sheet forms a part of the latest issue of Raychem Specification 55PC.
|
Tyco Electronics
|
| PXA255 GDPXA255A0E400 LUPXA255A0E400 LUPXA255A0C20 |
Electrical, Mechanical, and Thermal Specification
Intel? PXA255 Processor Electrical, Mechanical, and Thermal Specification
|
Intel Corporation
|
