| PART |
Description |
Maker |
| C5750X7S2A106MT |
SPECIFICATION FOR TDK MULTILAYER CERAMIC CHIP CAPACITORS
|
TDK Electronics
|
| C1005X7S2A103MT |
SPECIFICATION FOR TDK MULTILAYER CERAMIC CHIP CAPACITORS
|
TDK Electronics
|
| CAK-001 CAK-001MF CAK-001AF CAK-2405F CAK-002AF CA |
TDK DC to DC Converters, DC to AC inverters
|
TDK[TDK Electronics]
|
| C2012X7R1E225K C2012X7R1E475K C1608X7R1H474K C1608 |
TDK MLCC PRODUCT LINE
2012 MLCC PRODUCT GUIDE
TDK MLCC PRODUCT LINE
2012 MLCC PRODUCT GUIDE
|
TDK Electronics
|
| 55PC0233 |
This specification sheet forms a part of the latest issue of Raychem Specification 55PC.
|
TE Connectivity Ltd
|
| 55PC0223 |
This specification sheet forms a part of the latest issue of Raychem Specification 55PC.
|
Tyco Electronics
|
| 55PC0226 |
This specification sheet forms a part of the latest issue of Raychem Specification 55PC.
|
TE Connectivity Ltd
|
| 55PC1131 |
This specification sheet forms a part of the latest issue of Raychem Specification 55PC.
|
Tyco Electronics
|
| 749010013 744761068A |
All 16 terminals must lie on a plane within 004 of surface A after lead tinning
specification for release
specification for release
|
Wurth Elektronik GmbH & Co. KG, Germany.
Wurth Elektronik GmbH &...
|
| PXA255 GDPXA255A0E400 LUPXA255A0E400 LUPXA255A0C20 |
Electrical, Mechanical, and Thermal Specification
Intel? PXA255 Processor Electrical, Mechanical, and Thermal Specification
|
Intel Corporation
|
| SE7210TP1-E |
Intel庐 Server Board Technical Product Specification
Intel? Server Board Technical Product Specification
|
Intel Corporation
|
| TP0101K TP0101K-T1-E3 TP0101T |
TP0101K vs. TP0101T Specification Comparison
TP0101K vs. TP0101T Specification Comparison
P-Channel 20-V (D-S) MOSFET, Low-Threshold P通道20 - V（下局副局长）MOSFET的低阈
|
VISAY[Vishay Siliconix]
Vishay Intertechnology,Inc.
Vishay Intertechnology, Inc.
|
