| PART |
Description |
Maker |
| HN7G02FU |
TOSHIBA Multi Chip Discrete Device
|
TOSHIBA[Toshiba Semiconductor]
|
| TPCP8J01 |
TOSHIBA Multi-chip Device Silicon P Channel MOS Type (U-MOSIV) Silicon NPN Epitaxial Type
TOSHIBA Multi-chip Device Silicon P Channel MOS Type (U-MOSIV) /Silicon NPN Epitaxial Type
MOSFET TPC Series
|
Toshiba Corporation
TOSHIBA[Toshiba Semiconductor]
|
| HN2E04F |
MULTI CHIP DISCRETE DEVICE Super High Speed Switching Application
|
Toshiba Corporation
Toshiba Semiconductor
|
| HN2E01F07 HN2E01F |
MULTI CHIP DISCRETE DEVICE Super High Speed Switching Application
|
Toshiba Corporation
Toshiba Semiconductor
|
| 585-3211 585-3213 585-3215 585-3221 585-3225 585-3 |
Multi-Chip BASED LED T1 3/4 Bi-Pin
585 SERIES BASED LEDs-MULTI-CHIP SINGLE COLOR DISPLAY CLUSTER, RED, 5.9 mm
|
Dialight Corporation
Dialight PLC
|
| ISD1100P ISD1100X ISD1112 ISD1110 ISD1120 ISD1110P |
Single-Chip Voice Record/Playback Device（Single-chip Durations of 12 seconds)(单片的录录音重放一片信息存储持续时12秒）) 单芯片语音记播放设备（单芯片的持续时12秒）（单片的录音/录音重放器（一片信息存储持续时12秒）
Single-Chip Voice Record/Playback Devices 10- and 12-Second Durations(单片声音录音/回放芯片(单片信息存储持续时间12秒钟))
Single-Chip Voice Record/Playback Device（Single-chip Durations of 10 seconds)(单片的录录音重放一片信息存储持续时0秒）)
Single-Chip Voice Record/Playback Device（Single-chip Durations of 12 seconds)(单片的录录音重放一片信息存储持续时2秒）)
SINGLE CHIP VOICE RECORD / PLAYBACK DEVICES
RES POWER .360 OHM 1W 5% SMT
|
List of Unclassifed Manufacturers
Winbond Electronics, Corp.
Winbond Electronics Corp
ETC
Electronic Theatre Controls, Inc.
|
| WS512K8L-20CM WS512K8L-20CQA WS512K8-XCX WS512K8-2 |
512K X 8 MULTI DEVICE SRAM MODULE, 45 ns, CDIP32
512K X 8 MULTI DEVICE SRAM MODULE, 35 ns, CDIP32
512K X 8 MULTI DEVICE SRAM MODULE, 25 ns, CDIP32
512Kx8 SRAM MODULE, SMD 5962-92078
|
WEDC[White Electronic Designs Corporation]
|
| OP905 |
PIN Sili con Pho todiode
|
OPTEK[OPTEK Technologies]
|
| OP993 |
PIN Sili con Pho todiode
|
OPTEK[OPTEK Technologies]
ETC
|
| CYM1836 1836 CYM1836PZ-45C CYM1836P8-15C CYM1836P8 |
128K x 32 Static RAM Module 128K X 32 MULTI DEVICE SRAM MODULE, 15 ns, ZMA64
128K x 32 Static RAM Module 128K X 32 MULTI DEVICE SRAM MODULE, 15 ns, SMA64
128K x 32 Static RAM Module 128K X 32 MULTI DEVICE SRAM MODULE, 35 ns, SMA64
128K x 32 Static RAM Module 128K X 32 MULTI DEVICE SRAM MODULE, 30 ns, SMA64
128K x 32 Static RAM Module 128K X 32 MULTI DEVICE SRAM MODULE, 30 ns, PSMA72
128K x 32 Static RAM Module 128K X 32 MULTI DEVICE SRAM MODULE, 30 ns, ZMA64
128K x 32 Static RAM Module 128K X 32 MULTI DEVICE SRAM MODULE, 15 ns, PSMA72
128K x 32 Static RAM Module 128K X 32 MULTI DEVICE SRAM MODULE, 45 ns, PSMA72
128K x 32 Static RAM Module 128K X 32 MULTI DEVICE SRAM MODULE, 35 ns, PSMA72
128K x 32 Static RAM Module 128K X 32 MULTI DEVICE SRAM MODULE, 25 ns, PSMA72
128K x 32 Static RAM Module 128K X 32 MULTI DEVICE SRAM MODULE, 25 ns, SMA64
From old datasheet system
|
Cypress Semiconductor, Corp.
Cypress Semiconductor Corp.
CYPRESS[Cypress Semiconductor]
|
| SYS32512ZK-010 SYS32512ZK-012 SYS32512ZK-015 SYS32 |
512 K x 32 Static RAM
512K X 32 MULTI DEVICE SRAM MODULE, 12 ns, PZMA72 PLASTIC, ZIP-72
512K X 32 MULTI DEVICE SRAM MODULE, 10 ns, PZMA72 PLASTIC, ZIP-72
512K X 32 MULTI DEVICE SRAM MODULE, 12 ns, PSMA72 PLASTIC, SIMM-72
512K X 32 MULTI DEVICE SRAM MODULE, 10 ns, PSMA72 PLASTIC, SIMM-72
512 K x 32 Static RAM 512亩32静态RAM
|
Amphenol, Corp.
MOSAIC
http://
Fujitsu, Ltd.
NXP Semiconductors N.V.
|
