| PART |
Description |
Maker |
| M6MGB64BM34CWG-P M6MGT64BM34CWG-P |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
|
Renesas
|
| M6MGD13VW66CWG |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
|
Renesas
|
| M6MGD13TW66CWG |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
|
Renesas
|
| CM1203 CM1203-01CP CM1203-01CS CM1203-02CP CM1203- |
1, 2 and 3-Channel ESD Arrays in CSP 1通道的ESD阵列的总警
1, 2 and 3-Channel ESD Protection Arrays in Chip Scale Package with OptiGuard™ Coating (CSPESD301/302/303 pin compatible)
|
California Micro Devices Corporation
|
| AN1235 |
FLIP-CHIP CSP: PACKAGE DESCRIPTION AND RECOMMENDATIONS FOR USE
|
SGS Thomson Microelectronics
|
| FCSP05H40TR |
Chip Scale Package Schottky Barrier Rectifier, 0.5 A
|
Vishay Siliconix
|
| FCSP130LTR |
Chip Scale Package Schottky Barrier Rectifier
|
Vishay Siliconix
|
| SDM0230CSP |
0.2A SCHOTTKY BARRIER DIODE CHIP SCALE PACKAGE
|
Diodes
|
| SDM0230CSP |
0.2A SCHOTTKY BARRIER DIODE CHIP SCALE PACKAGE
|
Diodes Incorporated
|
| FCSP140TR |
Chip Scale Package Schottky Barrier Rectifier
|
Vishay Siliconix
|
