PART |
Description |
Maker |
YPKG-BCCG-9287DC |
CCGA1152, 35.0 MM X 35.0 MM, 1.0 MM PITCH, 1152 SOLDER COLUMNS, CERAMIC COLUMN GRID ARRAY, DAISY CHAIN PACKAGE
|
Actel Corporation
|
8143RPFS 8143 8143RPFB 8143RPFE 8143RPFI |
12-Bit Serial Daisy Chain D/A Converter
|
MAXWELL[Maxwell Technologies]
|
DAC8143 DAC8143FP DAC8143FS |
12-Bit Serial Daisy-Chain CMOS D/A Converter
|
AD[Analog Devices]
|
TMP107BQDQ1 |
<font color=red>[Old version datasheet]</font> TMP107-Q1 Automotive Grade, ±0.4°C Temperature Sensor with Daisy-Chain UART, EEPROM, and Alert Function
|
TI store
|
BLPXA263B1C400 RCPXA260B1C200 QLPXA263B1C300 QLPXA |
32-BIT, 400 MHz, RISC PROCESSOR, PBGA294 13 X 13 MM, 1.4MM PITCH, LEAD FREE, PLASTIC, TPBGA-294 32-BIT, 200 MHz, RISC PROCESSOR, PBGA294 13 X 13 MM, 1.4MM PITCH, PLASTIC, TPBGA-294 32-BIT, 300 MHz, RISC PROCESSOR, PBGA294 13 X 13 MM, 1.4MM PITCH, PLASTIC, TPBGA-294 32-BIT, 400 MHz, RISC PROCESSOR, PBGA294 13 X 13 MM, 1.4MM PITCH, PLASTIC, TPBGA-294 32-BIT, 416 MHz, RISC PROCESSOR, PBGA336 14 X 14 MM, 1.45 MM PITCH, CSP-336 32-BIT, 416 MHz, RISC PROCESSOR, PBGA336 14 X 14 MM, 1.45 MM PITCH, LEAD FREE, CSP-336
|
Marvell Technology Group, Ltd. Intel, Corp. INTEL CORP
|
0900590014 90059-0014 |
2.54mm (.100) Pitch C-Grid? Micro Shunt, Low Profile, 4mm Gold Plating 2.54mm (.100) Pitch C-Grid庐 Micro Shunt, Low Profile, 4mm Gold Plating MOLEX Connector
|
Molex Electronics Ltd.
|
LTC3445 3445F |
I?C Controllable Buck Regulator with Two LDOs in a 4mm ? 4mm QFN From old datasheet system
|
LINEAR
|
MAX8631XETI |
1x/1.5x/2x White LED Charge Pump with Two LDOs in 4mm x 4mm Thin QFN
|
MAXIM INTEGRATED PRODUCTS INC
|
SX6E-144S-08SH |
0.8mm Pitch 4mm Mounting Height S.O. DIMM Socket
|
List of Unclassifed Manufacturers ETC[ETC]
|
21-0548 |
PACKAGE OUTLINE 30 BUMPS, WLP PKG. 0.4MM PITCH
|
Maxim Integrated Products
|
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