PART |
Description |
Maker |
NP291-04812-2-AC-14680 NP291-04812-2-G4-BF NP291-0 |
Fine Ball Grid Array (FBGA, 0.75mm Pitch)
|
Yamaichi Electronics Co., Ltd.
|
NP276-16951 NP276-25626 NP276-11904-3 NP276-59608 |
Ball Grid Array (BGA, 1.27mm Pitch)
|
Yamaichi Electronics Co., Ltd.
|
FL9B5BH030S-C FL9B5BH060S-C FL7B5BH FL9B5BH033S-C |
Ball-Grid-Array Thin Film Low-Pass Filter
|
ETC List of Unclassifed Manufacturers
|
AS4C32M16MD1A AS4C32M16MD1A-5BCN |
60 ball FBGA PACKAGE
|
Alliance Semiconductor ...
|
CHC-CH4ALF-01-1002-D-A CHC-CH8ALF-01-1002-D-A CHC- |
Precision Ceramic Ball Grid Arrays
|
IRC - a TT electronics Company.
|
AS7C3512K18P-4TQC AS7C3512K18P-4BC AS7C3512K18P-3. |
512K X 18 STANDARD SRAM, 4 ns, PQFP100 14 X 20 MM, TQFP-100 512K X 18 STANDARD SRAM, 4 ns, PBGA119 CSP, FBGA-119 512K X 18 STANDARD SRAM, 3.5 ns, PQFP100 14 X 20 MM, TQFP-100 512K X 18 STANDARD SRAM, 3.8 ns, PQFP100 14 X 20 MM, TQFP-100 512K X 18 STANDARD SRAM, 3.5 ns, PBGA119 CSP, FBGA-119 512K X 18 STANDARD SRAM, 5 ns, PBGA119 CSP, FBGA-119
|
Alliance Semiconductor, Corp.
|
CSPESD304 |
4-Channel ESD Array in CSP
|
California Micro Devices
|
M6MGD13TW34DWG-P |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
|
Renesas
|
M6MGD13VW66CWG |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
|
Renesas
|
LC5768VG-10F484I LC5768VG-10F256I LC5768VG-10F256C |
EE PLD, 12 ns, PBGA484 FBGA-484 EE PLD, 12 ns, PBGA256 FBGA-256 EE PLD, 10 ns, PBGA676 FBGA-676 EE PLD, 10 ns, PBGA484 FBGA-484 EE PLD, 10 ns, PBGA256 FBGA-256 EE PLD, 5 ns, PBGA256 FBGA-256 EE PLD, 5 ns, PBGA484 FBGA-484 EE PLD, 7.5 ns, PBGA484 FBGA-484 EE PLD, 7.5 ns, PBGA256 FBGA-256
|
Lattice Semiconductor, Corp. Lattice Semiconductor Corporation
|
FCRN303 FCRN3031003FA |
Percision thin film resistor CSP 0805 PRECISION THIN FILM RESISTOR CSP (CHIP SCALE PACKAGE)
|
CALMIRCO[California Micro Devices Corp]
|