PART |
Description |
Maker |
EPC-1300-3.0-1 |
Photodiode-Chip
|
EPIGAP optoelectronic GmbH
|
EPC-1300-0.5-4 |
Photodiode-Chip
|
EPIGAP optoelectronic GmbH
|
EPC-740-0.5 |
Photodiode-Chip
|
EPIGAP optoelectronic GmbH
|
EPC-470-0.9 |
Photodiode-Chip
|
EPIGAP optoelectronic GmbH
|
EPC-880-0.9-1 |
Photodiode-Chip
|
EPIGAP optoelectronic GmbH
|
EPC-660-0.9-1 |
Photodiode-Chip
|
EPIGAP optoelectronic GmbH
|
EPC-1300-0.22-3 |
Photodiode-Chip
|
EPIGAP optoelectronic GmbH
|
KIP-M25-1 |
Optical Monitoring Photodiode Chip
|
KODENSHI KOREA CORP.
|
KIP-M1M-1 KIP-M2M-1 KIP-M3M-1 |
Optical Monitoring Photodiode Chip for KIP-MxM
|
KODENSHI KOREA CORP.
|
S8865-256 S8865-256G |
Photodiode array combined with signal processing circuit chip
|
Hamamatsu Corporation
|
S8865-64 S8865-128 S8865 |
Photodiode array combined with signal processing circuit chip
|
Hamamatsu Corporation
|
S2592 |
Si photodiode Thermoelectrically cooled photodiode for low-light-level detection in UV to near IR
|
Hamamatsu Photonics
|