| PART |
Description |
Maker |
| TO263 |
Package Outline Drawing Transistor Outline 封装外形图晶体管外形
|
Electronic Theatre Controls, Inc.
ETC
List of Unclassifed Manufacturers
|
| MRAC75S MNAC104S MNAC50S MNAC34S MNAC50SJTDH8 MNAC |
COMPSITE OUTLINE ASSY
34 CONTACT(S), FEMALE, MULTIWAY RACK AND PANEL CONN, SOLDER, SOCKET
COMPOSITE OUTLINE ASSY
|
Winchester Electronics ...
Winchester Electronics Corporation
Winchester Electronics Corp...
|
| PC1604-A |
OUTLINE DIMENSION & BLOCK DIAGRAM
OUTLINE DIMENSION & BLOCK DIAGRAM
|
Powertip Technology Corp.
POWERTIP[Powertip Technology]
|
| HYM324000GD-60 HYM324000GD-50 |
4M x 32-Bit Dynamic RAM Module SMALL OUTLINE MEMORY MODULE 4M X 32 FAST PAGE DRAM MODULE, 60 ns, ZMA72
CAP 0.5PF 50V /-0.2PF THIN-FILM SN96/AG4/NI 30PPM TR-7-PA
4M x 32 Bit DRAM Module (SO-DIMM)
-4M x 32-Bit Dynamic RAM Module SMALL OUTLINE MEMORY MODULE
|
SIEMENS A G
SIEMENS AG
SIEMENS[Siemens Semiconductor Group]
Infineon
|
| 16765 16765-04 |
OUTLINE DRAWING, HUB1200-S 外形图，HUB1200 -
OUTLINE DRAWING HUB1200-S
|
Vicor, Corp.
VICOR[Vicor Corporation]
|
| 16769 16769-04 |
BOX 3.4X2.56X1.02 W/0 BTNS ALMOND
BOX 3.4X2.56X1.02 W/0 BTNS BLK2
OUTLINE DRAWING, HUB470-P
OUTLINE DRAWING HUB470-P
|
VICOR[Vicor Corporation]
|
| 080-25125-0001 |
OUTLINE L
|
API Technologies Corp
|
| SSOP-28 |
Package Outline
|
Global Mixed-mode Techn...
|
| SC70-3 SOT323 |
Package Outline
|
Global Mixed-mode Techn...
|
