| PART |
Description |
Maker |
| H48-2K |
Thermal Conductive Pad on rolls
|
List of Unclassifed Manufacturers
|
| 16190 16190-8 |
THERMAL INTERFACE PAD (MINI)
THERMAL INTERFACE PAD, (MINI)
|
VICOR[Vicor Corporation]
|
| AND8044 AND8044_D AND8044/D |
Single-Channel 1206A ChipFET TM Power MOSFET Recommended Pad Pattern and Thermal Performance
|
ONSEMI
ON Semiconductor
|
| SOT545-3 |
plastic thermal enganced thin quad flat package; 48 leads; body 7 x 7 x 1 mm; exposed die pad
|
NXP Semiconductors
PHILIPS[Philips Semiconductors]
|
| P2NR |
For suggested pad layout, see drawing: PAD-01
|
All Sensors Corporation
|
| ZTACV ZTACV-MX-20.000 ZTTCV-MX-20.000 |
2 Pad and 3 Pad Ceramic Package, 3.1 mm x 3.7 mm
|
ILSI America LLC
|
| 12.000MQ22030-101860 12.000MQ2030-101860 MQ2 MQ203 |
7 x 5mm SMD, 4 pad or 2 pad
|
EUROQUARTZ limited
|
| MP503 |
TMP FEMALE BULKHEAD TO SEMI-RIGID CABLE
|
List of Unclassifed Man...
|
| SE2003-DC70A |
High speed thermal printhead (with thermal historical control)
|
ROHM[Rohm]
|
| KD2003-DC72A |
Thick film thermal printhead (with thermal historical control)
|
Rohm
|
