| PART |
Description |
Maker |
| 408-8737 |
The die assembly consists of an indenter die and nest die. Each die is held in the tool by a single screw
|
Tyco Electronics
|
| 5SMX12H1273 |
IGBT-Die
|
The ABB Group
|
| 5SMY12J1200 |
IGBT-Die
|
The ABB Group
|
| 5SMY12H1200 |
IGBT-Die
|
The ABB Group
|
| IRG4CH40SB |
IRG4CH40SB IGBT Die in Wafer Form
|
IRF[International Rectifier]
|
| IRG4CH50UB |
IRG4CH50UB IGBT Die in Wafer Form
|
Fairchild Semiconductor, Corp.
International Rectifier
|
| IRG4CH50KB |
IRG4CH50KB IGBT Die in Wafer Form
|
International Rectifier
|
| IRG4CH40UB |
IRG4CH40UB IGBT Die in Wafer Form
|
International Rectifier
|
| IRG4CH30KB |
IRG4CH30KB IGBT Die in Wafer Form
|
International Rectifier
|
| IRG4CC30UB |
IRG4CC30UB IGBT Die in Wafer Form
|
International Rectifier
|
| IRG4CC10KB |
IRG4CC10KB IGBT Die in Wafer Form
|
International Rectifier
|
| IRG4CC10UB |
IRG4CC10UB IGBT Die in Wafer Form
|
International Rectifier
|
