| PART |
Description |
Maker |
| M6MGT331S4BKT M6MGB331S4BKT |
Memory>MCP(Multi Chip Package)>S-µMCP(Stacked micro MCP)
|
Renesas
|
| KPC6N137 |
Super High Speed Response Photocoupler
|
COSMO Electronics Corporation
|
| KPC410 |
Super High Speed Response Photocoupler
|
COSMO Electronics
|
| VSV-3.3S8R0M VSV-3.3S6R0M VSV-3.3S3R0M |
High-Speed Response Step-Down DC-DC Converter
|
Volgen Kaga Electronics Inc.
|
| IS456 |
High Speed Response Type OPIC Light Detector
|
Sharp Corporation
SHARP[Sharp Electrionic Components]
|
| BU6650NUX BU6651NUX BU6652NUX BU6653NUX BU665XNUX |
High-speed Load Response Full CMOS LDP Regulators
|
Rohm
|
| ADCMP56305 ADCMP563BCP-R2 ADCMP563BCP-RL7 ADCMP563 |
Dual High Speed ECL Comparator 16 - Lead QSOP; Package: LFCSP (3x3mm, 1.50mm exposed pad); No of Pins: 16; Temperature Range: Commercial DUAL COMPARATOR, 10000 uV OFFSET-MAX, 0.83 ns RESPONSE TIME, QCC16
Dual, High Speed ECL Comparators
|
ANALOG DEVICES INC
Analog Devices, Inc.
|
| S9703-01 S9703 |
Photo IC for laser beam synchronous detection High sensitivity, high-speed response
|
Hamamatsu Corporation
|
| S71WS-NX0 S71WS512ND0BFWA23 S71WS512NC0BFWA23 S71W |
Stacked Multi-Chip Product (MCP) 堆叠式多芯片产品（MCP
|
Spansion Inc.
Spansion, Inc.
SPANSION LLC
|
| EZ55Z3L-ZADJTR EZ55Z3L-ZADJTA EZ55Z3L-Z3.3TA EZ55Z |
THS6032 High Speed Amplifier Evaluation Modules
THS3001 High Speed Amplifier Evaluation Modules
THS6012 High Speed Amplifier Evaluation Modules
THS4042 High Speed Amplifier Evaluation Module
THS6022 High Speed Amplifier Evaluation Modules 积极的固定电压稳压器
THS4061 High Speed Amplifier Evaluation Module 积极的固定电压稳压器
THREE-TERMINAL POSITIVE FIXED VOLTAGE REGULATORS 三端固定电压调节
THS4012 High Speed Amplifier Evaluation Module 积极的固定电压稳压器
Positive Adjustable Voltage Regulator 积极可调电压稳压
THS4052 High Speed Amplifier Evaluation Module 积极的固定电压稳压器
ADS8383 Evaluation Module 积极可调电压稳压
THS4041 High Speed Amplifier Evaluation Module 积极的固定电压稳压器
|
Semtech, Corp.
Everlight Electronics Co., Ltd.
Taiwan Semiconductor Co., Ltd.
Black Box, Corp.
|
| S70WS512N00BFWA23 S70WS512N00BAWAB3 S70WS512N00BAW |
Same-Die Stacked Multi-Chip Product (MCP) 512 Megabit (32M x 16 bit) CMOS 1.8 Volt-only Simultaneous Read/Write, Burst-mode Flash Memory 同硅晶片堆叠多芯片产品（MCP）的512兆位2兆16位）的CMOS 1.8伏，只有同时写，突发模式闪存
|
Spansion Inc.
Spansion, Inc.
|
