| PART |
Description |
Maker |
| F4655-1305 |
High-Speed Response MCP Assembly Ideal for High Resolution TOF-MS Detector Incorporates a Two-Stage MCP with 4 μm Channel Diameter
High-Speed Response MCP Assembly Ideal for High Resolution TOF-MS Detector Incorporates a Two-Stage MCP with 4 レm Channel Diameter
|
Hamamatsu Corporation
|
| F2223-21SH |
MCP ASSEMBLY
|
Hamamatsu Photonics
|
| F4655-12 |
COMPACT MCP ASSEMBLY FOR TOF
|
Hamamatsu Photonics
HAMAMATSU[Hamamatsu Corporation]
|
| F4655-13 |
MCP ASSEMBLY FOR HIGH RESOLUTION TOF-MS
|
Hamamatsu Photonics
HAMAMATSU[Hamamatsu Corporation]
|
| F4655-01 |
WIDE DYNAMIC RANGE MCP ASSEMBLY FOR HELIUM LEAK DETECTOR
|
Hamamatsu Photonics
HAMAMATSU[Hamamatsu Corporation]
|
| F2224-11M F2224-11P F2224-11S F2224-14 F2224-14M F |
Circular MCP and assembly series. For analytical instruments, electron tibe, cosmic measurement, high energy physics
|
Hamamatsu Corporation
|
| DS42546 AM29DL163D |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
From old datasheet system
MCP Flash Memory and SRAM
|
AMD[Advanced Micro Devices]
|
| AM70PDL127CDH66IT AM70PDL127CDH85IS AM70PDL127CDH8 |
Stacked Multi-Chip Package (MCP/XIP) Flash Memory, Data storage MirrorBit Flash, and pSRAM (XIP) 堆叠式多芯片封装（MCP / XIP）的快闪记忆体，数据存储的MirrorBit闪存和移动存储芯片（XIP）的
Stacked Multi-Chip Package (MCP/XIP) Flash Memory, Data storage MirrorBit Flash, and pSRAM (XIP) SPECIALTY MEMORY CIRCUIT, PBGA93
2 x 64 Megabit (8 M x 16-Bit) CMOS 3.0 Volt-Only Page Mode Flash Memory Data Storage 128 Megabit (8 M x 16-Bit) CMOS 2 × 64兆位米16位）的CMOS 3.0伏特，只有页面模式闪存数据存28兆位米16位）的CMOS
|
Spansion Inc.
Spansion, Inc.
|
| K522H1HACF-B050 |
MCP Specification
|
Samsung semiconductor
|
| KAG00J007M-FGG2 |
MCP Memory
|
Samsung Electronics
|
| KA100O015E-BJTT |
MCP Specification
|
Samsung semiconductor
|
| WF1M32B-XHX3 WF1M32B-XG2TX3 |
Flash MCP 闪存MCP
|
OKI SEMICONDUCTOR CO., LTD.
|
