| PART |
Description |
Maker |
| W82MV-NSBC W82MV-NSBI |
2Mx32 SRAM 3.3V MULTI-CHIP PACKAGE
|
http://
|
| K3S7V2000M-TC15 K3S7V2000M-TC12 K3S7V2000M-TC10 K3 |
64M-Bit (4Mx16 /2Mx32) Synchronous MASKROM 6400位（4Mx16 / 2Mx32）同步MASKROM
2M X 32 MASK PROM, 6 ns, PDSO86
|
SAMSUNG SEMICONDUCTOR CO. LTD.
Samsung Semiconductor Co., Ltd.
|
| MB84VD21181EM-70PBS MB84VD21183EM-70PBS MB84VD2118 |
Stacked MCP (Multi-Chip Package) FLASH MEMORY & SRAM CMOS
Stacked MCP (Multi-Chip Package) FLASH MEMORY & SRAM CMOS SPECIALTY MEMORY CIRCUIT, PBGA56
|
Spansion Inc.
Spansion, Inc.
|
| IDT7010S35FB IDT7010S35L48B IDT7010L25P |
1K X 9 MULTI-PORT SRAM, 35 ns, CQFP48
1K X 9 MULTI-PORT SRAM, 35 ns, CQCC48
1K X 9 MULTI-PORT SRAM, 25 ns, PDIP48
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| AM41DL32X4G |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
SPANSION
|
| AM41DL3208GB30IT AM41DL3208GB35IT AM41DL3208GB40IT |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
Advanced Micro Devices
|
| DS42516 AM29DL324D |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
AMD[Advanced Micro Devices]
|
| A82DL1622T |
(A82DL16x2T) Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
AMIC Technology
|
| AS8S512K32AQ1-25L_Q AS8S512K32P-17L/IT AS8S512K32P |
512K X 32 MULTI DEVICE SRAM MODULE, 17 ns, CQFP68
512K X 32 MULTI DEVICE SRAM MODULE, 20 ns, CQFP68
512K X 32 MULTI DEVICE SRAM MODULE, 15 ns, CQFP68
512K X 32 MULTI DEVICE SRAM MODULE, 17 ns, CPGA66 PGA-66
512K x 32 SRAM SRAM MEMORY ARRAY
|
Micross Components
Austin Semiconductor
|
| AM45DL3208GT70IS AM45DL3208GT85IS AM45DL3208GT70IT |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
Advanced Micro Devices, Inc.
ADVANCED MICRO DEVICES INC
|
