| PART |
Description |
Maker |
| MF1302T-1R8 MF1501T-1R5 MF1304T-6R8 MF1303T-100 MF |
Axial Molded Choke
0.5-2.5 GHz Ultralinear Mixer w/LO Buffer
8.5 - 11 GHz 6-bit Phase Shifter
Low Noise Amp, SB
Gain Block
X-band Discrete Power pHEMT
Ku-band Discrete Power pHEMT
18mm HFET
24mm HFET
Cell-Band CDMA PA Module; 1-Bit
Cell-Band PA Module; 1-Bit
|
ECM Electronics Limited.
|
| TGF4124-EPU TGF4124 |
24 mm Discrete HFET
|
TriQuint Semiconductor,Inc.
TRIQUINT[TriQuint Semiconductor]
|
| TGF4118-EPU TGF4118 |
18 mm Discrete HFET
|
TriQuint Semiconductor,Inc.
TRIQUINT[TriQuint Semiconductor]
|
| TGF4260 TGF4260-EPU |
9.6mm Discrete HFET
|
TRIQUINT[TriQuint Semiconductor]
|
| FP1189 |
HFET
|
WJ Communications
|
| FP2189-RFID FP2189-PCB900S FP2189-G FP2189-PCB1900 |
1 - Watt HFET
|
WJ Communication. Inc.
|
| SHF-0186 |
0.05-12 GHz, 0.5 Watt GaAs HFET
|
SIRENZA[SIRENZA MICRODEVICES]
|
| FP31QF-PCB900 FP31QF FP31QF-F FP31QF-PCB1900 FP31Q |
2-Watt HFET 2瓦异质结场效应晶体管
12 AMP MINIATURE POWER RELAY 2瓦异质结场效应晶体管
|
WJ Communications
WJCI[WJ Communication. Inc.]
Electronic Theatre Controls, Inc.
|
| HI3-0201HS4 HI3-0201HS5 HI1-0201HS2 HI1-0201HS5 HI |
Box-shaped pin header, Discrete wire crimping connection, Discrete wire connectors; HRS No: 536-0414-4 90; Contact Mating Area Plating: Tin
Interface IC 接口IC
|
Intersil, Corp.
|
| HI1-0507A2 HI1-0506A5 HI1-0507A5 HI1-0506A2 HI3-05 |
Box-shaped pin header, Discrete wire crimping connection, Discrete wire connectors; HRS No: 536-0402-5 90; Contact Mating Area Plating: Tin
Interface IC 接口IC
|
Intersil, Corp.
|
| 2SJ226 |
Box-shaped pin header, Discrete wire crimping connection, Discrete wire connectors; HRS No: 543-0503-0 00; No. of Positions: 8; Connector Type: Wire
Very High-Speed Switching Applications
|
Sanyo Electric Co.,Ltd.
SANYO[Sanyo Semicon Device]
|
