| PART |
Description |
Maker |
| HA12133MP |
PRE, REC, eguallzer IC for R-DAT
PRE,REC,EQUALLZER IC FOR R-DAT
|
Hitachi Semiconductor
|
| MDP0040 |
PACKAGE OUTLINE DRAWING QSOP - 0.150 NARROW BODY PACKAGE
|
Elantec Semiconductor
|
| 8SOIC |
8 PIN SOIC PACKAGE OUTLINE
8 PIN SOIC PACKAGE OUTLINE
|
SMSC[SMSC Corporation]
|
| AP2309AGN-HF |
3.4 A, 30 V, 0.075 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
|
| TO92 |
Through hole, 3 pin package Package outline
|
Zetex Semiconductors
|
| HD49227FS |
0.3-6.7 V, RAM controller for data/DAT
|
Hitachi Semiconductor
|
| PSB4600-FV1.2 |
PITA (PCI Interface for Telephony/Dat...
|
Infineon
|
| WLCSP15X15-163 |
Package Outline
|
Global Mixed-mode Techn...
|
| SOT23-3 |
Package Outline
|
Global Mixed-mode Techn...
|
| TQFN5X5-12 |
Package Outline
|
Global Mixed-mode Techn...
|
| TQFN4X4-28 |
Package Outline
|
Global Mixed-mode Techn...
|
