PART |
Description |
Maker |
PG160128-A |
OUTLINE DIMENSION & BLOCK DIAGRAM 外形尺寸 OUTLINE DIMENSION & BLOCK DIAGRAM
|
Powertip Technology, Corp. POWERTIP[Powertip Technology]
|
PG12232-E- PG12232-E-33 |
OUTLINE DIMENSION & BLOCK DIAGRAM 外形尺寸 OUTLINE DIMENSION & BLOCK DIAGRAM
|
Powertip Technology, Corp. Powertip Technology Corp. POWERTIP[Powertip Technology]
|
PG160160-C |
OUTLINE DIMENSION & BLOCK DIAGRAM OUTLINE DIMENSION & BLOCK DIAGRAM
|
Powertip Technology Corp. POWERTIP[Powertip Technology]
|
PG320240-D |
OUTLINE DIMENSION & BLOCK DIAGRAM OUTLINE DIMENSION & BLOCK DIAGRAM
|
Powertip Technology Corp. POWERTIP[Powertip Technology]
|
PG240128-A PG240128 |
OUTLINE DIMENSION & BLOCK DIAGRAM OUTLINE DIMENSION & BLOCK DIAGRAM
|
Powertip Technology Corp. POWERTIP[Powertip Technology]
|
HYM324000GD-60 HYM324000GD-50 |
4M x 32-Bit Dynamic RAM Module SMALL OUTLINE MEMORY MODULE 4M X 32 FAST PAGE DRAM MODULE, 60 ns, ZMA72 CAP 0.5PF 50V /-0.2PF THIN-FILM SN96/AG4/NI 30PPM TR-7-PA 4M x 32 Bit DRAM Module (SO-DIMM) -4M x 32-Bit Dynamic RAM Module SMALL OUTLINE MEMORY MODULE
|
SIEMENS A G SIEMENS AG SIEMENS[Siemens Semiconductor Group] Infineon
|
080-25126-0001 |
OUTLINE L1
|
API Technologies Corp
|
SOP-8 |
Packaging Outline
|
ETC List of Unclassifed Manufacturers
|
TQFN3X3-12 |
Package Outline
|
Global Mixed-mode Techn...
|
TQFN4X4-24 |
Package Outline
|
Global Mixed-mode Techn...
|