| PART |
Description |
Maker |
| MF0ICU1001W |
120 micro m Bumped sawn wafer on UV-tape contactless single-trip ticket ICs
|
NXP Semiconductors N.V.
|
| MASW-009590-000DIE MASW-009590-000D3K |
Bumped GaAs SPDT Switch
|
M/A-COM Technology Solutions, Inc.
|
| MASW-008902-000DIEV4 |
Bumped GaAs SP3T Switch for WLAN
|
M/A-COM Technology Solutions, Inc.
M/A-COM Technology Solu...
|
| 125SH-B-XX-TR-SMT |
WAFER 90 SMT
|
Adam Technologies, Inc.
|
| 15SH-A-XX-TR-SMT |
WAFER SMT
|
Adam Technologies, Inc.
|
| 55659-1819 55659-1219 55659-3619 55659-2019 |
Mini Mi2 2-Row Relay Wafer Assy 18Ckt 18-18 CONTACT(S), MALE-MALE, PANEL MOUNT, PCB ADAPTER
Mini Mi2 2-Row Relay Wafer Assy 12Ckt 12-12 CONTACT(S), MALE-MALE, PANEL MOUNT, PCB ADAPTER
Mini Mi2 2-Row Relay Wafer Assy 36Ckt 36-36 CONTACT(S), MALE-MALE, PANEL MOUNT, PCB ADAPTER
Mini Mi2 2-Row Relay Wafer Assy 20Ckt 20-20 CONTACT(S), MALE-MALE, PANEL MOUNT, PCB ADAPTER
|
Molex, Inc.
|
| HFA04SD60S |
Hexfred Die in Wafer Form
|
International Rectifier
|
| FD060U02A5B |
Fred Die in Wafer Form
|
International Rectifier
|
| FD160H06A5B |
Fred Die in Wafer Form
|
International Rectifier
|
| HF50A060ACE |
Hexfred Die in Wafer Form
|
International Rectifier
|
|
