| PART |
Description |
Maker |
| FPT-8P-M01 |
SMALL OUTLINE L-LEADED PACKAGE 小外形L -引线封装
|
Fujitsu Limited
Fujitsu, Ltd.
|
| AP2311GN-HF AP2311GN-HF-14 |
1.8 A, 60 V, 0.25 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
Advanced Power Electronics ...
|
| AP2305GN-HF AP2305GN-HF-14 |
4.2 A, 20 V, 0.053 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
Advanced Power Electron...
|
| SSOP24 |
24-LEAD SHRINK SMALL OUTLINE PACKAGE
|
STMicroelectronics
ST Microelectronics
|
| FPT-20P-M04 |
THIN SHRINK SMALL OUTLINE PACKAGE
|
Fujitsu Component Limited.
FUJITSU[Fujitsu Media Devices Limited]
|
| AP2323GN-HF |
Capable of 1.8V Gate Drive, Small Package Outline
|
Advanced Power Electronics Corp.
|
| AK18D300-TSOP AK14D300-TSOP AK20D300-TSOP |
Thin Small Outline Package TSOP DIP Adapters
|
ACCUTEK MICROCIRCUIT CORPORATION
ACCUTEK MICROCIRCUIT CORPOR...
ACCUTEK MICROCIRCUIT CO...
|
| SOT108-1 |
SO14: plastic small outline package; 14 leads; body width 3.9 mm
|
NXP Semiconductors
Philips Semiconductors
|
| AP2318AGEN-HF AP2318AGEN-HF-14 |
Capable of 2.5V Gate Drive, Small Outline Package, Surface Mount Device
|
Advanced Power Electronics Corp.
Advanced Power Electronics ...
|
| SOT765-1 |
plastic very thin shrink small outline package; 8 leads; body width 2.3 mm
|
NXP Semiconductors
PHILIPS[Philips Semiconductors]
|
| RM-8 |
8-Lead Mini Small Outline Package [MSOP] Dimensions shown in millimeters
|
Analog Devices
|
